isd1800 Winbond Electronics Corp America, isd1800 Datasheet

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isd1800

Manufacturer Part Number
isd1800
Description
Single-chip, Single-message Voice Record/playback Device 6- To 16-second Duration
Manufacturer
Winbond Electronics Corp America
Datasheet
PRELIMINARY
ISD1800 SERIES
SINGLE-CHIP, SINGLE-MESSAGE
VOICE RECORD/PLAYBACK DEVICE
6- TO 16-SECOND DURATION
Publication Release Date: June 7, 2005
- 1 -
Revision 0.3

Related parts for isd1800

isd1800 Summary of contents

Page 1

... ISD1800 SERIES SINGLE-CHIP, SINGLE-MESSAGE VOICE RECORD/PLAYBACK DEVICE 6- TO 16-SECOND DURATION - 1 - PRELIMINARY Publication Release Date: June 7, 2005 Revision 0.3 ...

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... GENERAL DESCRIPTION Winbond’s ISD1800 ChipCorder solution with user-selectable durations seconds. The CMOS devices include an on-chip oscillator (with external control), microphone preamplifier, automatic gain control, anti-aliasing filter, multilevel storage array, smoothing filter, and speaker amplifier. A minimum record/playback subsystem can be configured with a microphone, a speaker, several passive components, two push buttons, and a power source. Recordings are stored in on-chip nonvolatile memory cells, providing zero-power message storage. This unique, single-chip solution is made possible through Winbond’ ...

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... Power Conditioning CCA SSA SSD Timing Sampling Clock Active Analog Transceivers Antialiasing Filter Nonvolatile Multilevel Storage Array Switch FT CCD - 3 - ISD1800 SERIES Active Amp Smoothing Filter Device Control REC PLAYE PLAYL RECLED Publication Release Date: June 7, 2005 Revision 0 ...

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... AC Parameters ................................................................................................................... 18 11. TYPICAL APPLICATION CIRCUIT................................................................................................. 19 12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 20 12.1. 28-Lead 300mil Small Outline IC (SOIC) Package 12.2. 28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) – For Sampling Only 12.3. ISD1800 Bonding Physical Layout (Die) 13. ORDERING INFORMATION........................................................................................................... 24 14. VERSION HISTORY ....................................................................................................................... 25 ........................................................................................... 10 [1] ................................................................................................ 15 .......................................................... 20 ........................................................................... 22 ...

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... PIN CONFIGURATION VSSD 1 REC 2 PLAYE 3 PLAYL MIC MIC REF 12 AGC ISD1800 SERIES ISD1800 SOIC/PDIP Publication Release Date: June 7, 2005 - 5 - RECLED VCCD XCLK ROSC VCCA SP+ ...

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... PLAYE 3 PLAYL 11, 14, 20, 21, 22, 23, 24 ISD1800 SERIES I/O FUNCTION Ground Supplies: Similar to V analog and digital circuits internal to the I1800 device use separate ground buses to minimize noise. These pins should be tied together as close as possible to the device. I Record: The REC input is an active-HIGH record signal ...

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... PIN NAME PIN NO. MIC 10 MIC REF 12 AGC 13 SP-/SP+ 15, 17 ISD1800 SERIES I/O FUNCTION I Microphone Input: transfers its signals to the on-chip preamplifier. An on-chip Automatic Gain Control (AGC) circuit controls the gain of the preamplifier. An external microphone should be AC coupled to this pin via a series capacitor. The capacitor value, together with an internal 10 KΩ ...

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... RECLED 1 Note: The REC signal is internally debounced on the rising edge to prevent a false re-triggering from a push- button switch. ISD1800 SERIES I/O FUNCTION Voltage Supplies: Analog and digital circuits internal to the I1800 device use separate power buses to minimize noise on the chip. These power buses are brought out to separate pins on the package and should be tied together as close to the power supply as possible ...

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... Duration The ISD1800 devices offer single-chip solutions with seconds of record/playback duration capacity. Sampling rate and duration are determined by an external resistor connected to the ROSC pin. These specifications apply with the required resistor value for playback duration. ...

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... EOM marker to be placed. The device powers down automatically. 7. Playback a message that partially fills the memory Pulling the PLAYE or PLAYL pin HIGH initiates a playback cycle. The playback cycle ceases when the EOM marker is encountered and the device then powers down. E XAMPLE - 10 - ISD1800 SERIES devices. ISD1800 ...

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... Chart 1: ISD Duration Versus 25°C and V OSC A 80 100 120 Ω Typical R (K OSC Publication Release Date: June 7, 2005 - 11 - ISD1800 SERIES ). This means the ISD1800 OSC resistor to V OSC CC = 3.0V CC 140 160 ) Revision 0.3 to ...

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... FIGURE 1: RECORD MESSAGE UNTIL RECORD GOES LOW Operation Power-Down PLAYL PLAYE REC RECLED MIC MIC REF FIGURE 2: RECORD MESSAGE UNTIL ARRAY IS FULL Debounce Record 84 ms Debounce Record ISD1800 SERIES Power-Down INPUT MIC INPUT MIC REF Power-Down INPUT MIC INPUT MIC REF ...

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... Power-Down 84 ms PLAYL PLAYE REC RECLED MIC MIC REF 1.2 VOLTS SP + Open 1.2 VOLTS Open SP - FIGURE 4: PLAY LEVEL (PLAYL) PLAY UNTIL END OF MESSAGE ISD1800 SERIES W ink 84 ms Power-Down Play Don't Care No Edges Don't Care No Edges 1.2 VOLTS 1.2 VOLTS Wink 84 ms Power-Down Play 1.2 VOLTS 1.2 VOLTS ...

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... FIGURE 5: PLAY UNTIL PLAY LEVEL (PLAYL) FALLS Debounce Operation Power-Down 84 ms PLAYL PLAYE REC RECLED 1.2 VOLTS SP + Open 1.2 VOLTS Open SP - FIGURE 6: LOOPING PLAY, PLAYE TO RECLED ISD1800 SERIES W ink Pow er-Down Play 1.2 VOLTS 1.2 VOLTS Debounce Wink 84 ms Play 84 ms 1.2 VOLTS 1.2 VOLTS - 14 - Open Open Play ...

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... Stresses above those listed may cause permanent damage to the device. Exposure to the absolute maximum ratings may affect device reliability and performance. Functional operation is not implied at these conditions. [1] ABSOLUTE MAXIMUM RATINGS (DIE) CONDITION CONDITION - 15 - ISD1800 SERIES VALUE 150°C -65°C to +150°C (V –0.3V ...

Page 16

... OPERATING CONDITIONS (PACKAGED PARTS) CONDITION Commercial operating temperature range (Case temperature) [1] Play voltage ( [2] Ground voltage ( Record Supply voltage ( CCA CCD [ SSA SSD [ ISD1800 SERIES VALUE 0°C to +50°C +2.7V to +4.5V 0V +2.7V to 4.5V VALUE 0°C to +70°C +2.7V to +4.5V 0V +2.7V to 4.5V ...

Page 17

... REC, PLAYL and PLAYE. [8] Test limits of Final Test. [2] [1] SYMBOL MIN TYP IL 2 2.4 OH 0.5 30 150 3 8 EXT R 10 MIC, MICREF 40 MSP and V = 3.0V. ° SSD - 17 - ISD1800 SERIES [2] MAX UNITS CONDITIONS 4.5V CC [4] [5] 10 µA [6] +1 µA Force V SS [7] 400 µA ...

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... ISD1806 2.2 ISD1810 2.2 ISD1806 7.5 ISD1810 10 ISD1806 7.5 ISD1810 24.4 1. 100KΩ, unless stated. OSC and V = 3.0V ISD1800 SERIES [3] MAX UNITS CONDITIONS [4] KHz KHz 3 dB Roll-Off Point R = 100 KΩ OSC sec R = 100KΩ OSC sec R = 100KΩ OSC msec msec % @ 1KHz, V =15mV pk-to-pk ...

Page 19

... CCD V 0.1 CCA V SSD V SSA ISD1800 PLAYL C4 PLAYE μ 0.1 F REC MIC MIC REF RECLED AGC C6 XCLK μ 4 ISD1800 SERIES Ω μ (REXT) F Ω SPEAKER C1 R3 μ 220 F Ω 4.7 K ELECTRET MICROPHONE C5 R4 μ 0.1 F Ω 4.7 K Publication Release Date: June 7, 2005 ...

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... C 0.292 0.296 D 0.005 0.009 E 0.014 0.016 F 0.050 G 0.400 0.406 H 0.024 0.032 Note: Lead coplanarity to be within 0.004 inches (SOIC) P UTLINE ACKAGE B F Nom Max Min 0.711 17.81 0.104 2.46 0.299 7.42 0.0115 0.127 0.016 0.35 0.410 10.16 0.040 0. ISD1800 SERIES MILLIMETERS Nom Max 17.93 18.06 2.56 2.64 7.52 7.59 0.22 0.29 0.41 0.48 1.27 0 10.31 10.41 0.81 1.02 ...

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... H 0.100 J 0.008 0.010 S 0.070 0.075 q 0° (PDIP) – S UAL NLINE ACKAGE MILLIMETERS Max Min 1.455 36.70 0.075 1.65 0.625 15.24 0.550 13.46 0.19 0.38 0.135 3.18 0.022 0.38 0.065 1.40 0.012 0.20 0.080 1.78 15° 0° Publication Release Date: June 7, 2005 - 21 - ISD1800 SERIES O AMPLES NLY Nom Max 36.83 36.96 3.81 1.78 1.91 15.88 13.72 13.97 4.83 3.43 0.46 0.56 1.52 1.62 2.54 0.25 0.30 1.91 2.03 15° Revision 0.3 ...

Page 22

... ISD1800 B ONDING ISD1800 Die Dimensions o X: 2530µm (99.6mils) Y: 2420µm (95.3mils) Die Thickness o 11.5 +0.5 mil (typ) Pad Opening microns Notes: 1. The backside of die is internally connected to V damage may occur. 2. Die thickness is subject to change, please contact Winbond factory for status and availability. ...

Page 23

... ISD1800 PAD (X,Y) COORDINATES (with respect to die center) PAD # PAD Name 1 AGC 2 RECLED 3 VCCD 4 XCLK VSSD 7 REC 8 PLAYE 9 PLAYL 10 SP+ 11 ROSC 12 VCCA 13 VSSA 14 SP- 15 MIC 16 MIC REF ISD1800 SERIES Pin # X Axis (µm) 13 -522.35 28 -126.05 27 122.15 26 358 ...

Page 24

... For the latest product information, access Winbond’s worldwide website at http://www.winbond-usa.com ISD18xx Package Type: Part Number Ordering Number ISD1806X I1806X ISD1806S I1806S ISD1806P I1806P ISD1810X I1810X ISD1810S I1810S ISD1810P I1810P - 24 - ISD1800 SERIES X = Die S = Small Outline Integrated Circuit Package (SOIC Plastic Dual Inline Package (PDIP) Comments Samples Only Samples Only ...

Page 25

... Revise duration section with both products. Change filter passband values from 2.6 kHz to 2.2kHz in AC Parameters section. 0.1 Mar 2005 Revise series name from I1800 to ISD1800 Update block diagram Revise AGC in pin description Revise the MIC and MIC REF polarity in applications diagram Update die information section ...

Page 26

... ChipCorder datasheet supersedes all data for the ISD ChipCorder products All rights reserved. ChipCorder ® is the trademark of Silicon Storage Technology, Inc. All other trademarks - 26 - ISD1800 SERIES ® ® ChipCorder ® ® and ISD are trademarks of ...

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