w25q80bv Winbond Electronics Corp America, w25q80bv Datasheet - Page 65
w25q80bv
Manufacturer Part Number
w25q80bv
Description
8m-bit Serial Flash Memory With Dual And Quad Spi
Manufacturer
Winbond Electronics Corp America
Datasheet
1.W25Q80BV.pdf
(72 pages)
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12. PACKAGE SPECIFICATION
12.1 8-Pin SOIC 150-mil (Package Code SN)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
package.
SYMBOL
E1
D
CP
e
A1
A2
C
A
E
b
L
(2)
(3)
(3)
1.47
0.10
0.33
0.19
4.80
5.80
3.80
0.40
MIN
---
---
0
o
MILLIMETERS
1.27 BSC
TYP.
1.60
1.45
0.41
0.20
4.85
6.00
3.90
0.71
---
---
---
MAX
0.24
0.10
1.72
0.50
0.25
4.95
6.19
4.00
1.27
- 65 -
---
8
o
0.0075
0.058
0.004
0.013
0.189
0.228
0.150
0.015
MIN
---
---
0
o
Publication Release Date: March 26, 2009
0.050 BSC
INCHES
0.063
0.057
0.016
0.008
0.191
0.236
0.154
0.028
TYP.
---
---
---
0.0098
0.068
0.009
0.020
0.195
0.244
0.157
0.050
0.004
Preliminary - Revision A
MAX
---
8
W25Q80BV
o