aoz1014 Alpha & Omega Semiconductor, aoz1014 Datasheet - Page 12

• Manufacturer Part Number: aoz1014
• Description: Ezbuck 5a Simple Buck Regulator
• Manufacturer: Alpha & Omega Semiconductor

The junction to ambient temperature can be calculated
with power dissipation in the AOZ1014 and thermal
impedance from junction to ambient is:
The maximum junction temperature of AOZ1014 is
145°C, which limits the maximum load current capability.
Please see the thermal de-rating curves for maximum
load current of the AOZ1014 under different ambient
temperatures.
The thermal performance of the AOZ1014 is strongly
affected by the PCB layout. Extra care should be taken
by users during the design process to ensure that the IC
will operate under the recommended environmental
conditions.
Several layout tips are listed below for the best electric
and thermal performance. Figure 3 below illustrates a
PCB layout example as a reference.
1. Do not use thermal relief connection to the V
2. Input capacitor should be connected to the V
3. A ground plane is preferred. If a ground plane is not
4. Make the current trace from LX pins to L to Co to the
5. Pour copper plane on all unused board area and
6. The two LX pins are connected to the internal PFET
7. Keep sensitive signal traces away from the LX pins.
8. For the DFN package, thermal pad must be soldered
T
Rev. 1.0 December 2006
jun-amb
the PGND pin. Pour a maximized copper area to
the PGND pin and the V
dissipation.
and the PGND pin as close as possible.
used, separate PGND from AGND and connect them
only at one point to avoid the PGND pin noise
coupling to the AGND pin.
PGND as short as possible.
connect it to stable DC nodes, like V
drain. They are low resistance thermal conduction
path and most noisy switching node. Connect a
copper plane to the LX pin to help thermal
dissipation. This copper plane should not be too
large otherwise switching noise may be coupled to
other parts of the circuit.
to the PCB metal. When multiple layer PCB is used,
4 to 6 thermal vias should be placed on the thermal
pad and connected to PCB metal on other layers to
help thermal dissipation.
=
P
total _loss
–
P
IN
ind*dio _loss
pin to help thermal
IN
, GND, or V
JA
IN
IN
www.aosmd.com
and
pin
OUT
.
Figure 4. AOZ1014 (DFN-8) PCB Layout
Figure 3. AOZ1014 (SO-8) PCB Layout
AOZ1014
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