msm7542 Oki Semiconductor, msm7542 Datasheet
msm7542
Related parts for msm7542
msm7542 Summary of contents
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... MSM7541/7542 Single Rail CODEC GENERAL DESCRIPTION The MSM7541 and MSM7542 are single-channel CODEC CMOS ICs for voice signals ranging from 300 to 3400 Hz. These devices contain filters for A/D and D/A conversion. Designed especially for a single-power supply and low-power applications, these devices are optimized for telephone terminals in digital wireless systems. ...
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Semiconductor BLOCK DIAGRAM + AIN+ – RC AIN– Active GSX TMC – VFRO + SG SG PWI – AOUT– – AOUT BPF AD Transmit (8th) Conv. Controller Auto PLL Zero R–TIM LPF DA Receive (5th) ...
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Semiconductor PIN CONFIGURATION (TOP VIEW SGC AOUT+ AOUT AIN+ AOUT– AOUT– AIN– PWI PWI 4 17 GSX VFRO VFRO 5 16 TMC PDN ...
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Semiconductor PIN AND FUNCTIONAL DESCRIPTIONS AIN+, AIN–, GSX Transmit analog input and transmit level adjustment. AIN non-inverting input to the op-amp; AIN– inverting input to the op-amp; GSX is connected to the output of the ...
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Semiconductor PWI, AOUT+, AOUT– PWI is connected to the inverting input of the receive driver. The receive driver output is connected to the AOUT– pin. Therefore, the receive level can be adjusted with the pins VFRO, PWI, and AOUT–. ...
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Semiconductor RSYNC Receive synchronizing signal input. Eight required bits are selected from serial PCM signals on the PCMIN pin by the receive synchronizing signal. Signals in the receive section are synchronized by this synchronizing signal. This signal must be ...
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... A pull-up resistor must be connected to this pin because its output is configured as an open drain. This device is compatible with the ITU-T recommendation on coding law and output coding format. The MSM7542(A-law) outputs the character signal, inverting the even bits. Input/Output Level +Full scale +0 – ...
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Semiconductor SG Signal ground voltage output. The output voltage is 1/2 of the power supply voltage. The output drive current capability is 200 mA. This pin provides the SG level for CODEC peripherals. This output voltage level is undefined ...
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Semiconductor ABSOLUTE MAXIMUM RATINGS Parameter Symbol Power Supply Voltage V Analog Input Voltage V Digital Input Voltage V T Storage Temperature RECOMMENDED OPERATING CONDITIONS Parameter Symbol Power Supply Voltage V Operating Temperature Ta Analog Input Voltage V Digital Input ...
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Semiconductor ELECTRICAL CHARACTERISTICS DC and Digital Interface Characteristics Parameter Symbol I DD1 I DD4 Power Supply Current I DD2 I DD3 Input High Voltage V Input Low Voltage V High Level Input Leakage Current I Low Level Input Leakage ...
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Semiconductor Transmit Analog Interface Characteristics Parameter Symbol Input Resistance R Output Load Resistance R LGX Output Load Capacitance C LGX Output Amplitude V OGX Offset Voltage V OSGX Receive Analog Interface Characteristics Parameter Symbol Input Resistance R INPW R ...
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Semiconductor AC Characteristics Parameter Symbol Loss T1 Loss T2 Loss T3 Transmit Frequency Response Loss T4 Loss T5 Loss T6 Loss R1 Loss R2 Receive Frequency Response Loss R3 Loss R4 Loss Transmit Signal ...
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Semiconductor AC Characteristics (Continued) Parameter Symbol Nidle T Idle Channel Noise Nidle Absolute Level (Initial Difference Absolute Level (Deviation of Temperature and Power Absolute Delay Td tgd T1 tgd T2 ...
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Semiconductor AC Characteristics (Continued) Parameter Symbol Discrimination DIS Out-of-band Spurious Intermodulation Distortion IMD D-to-D Mode Gain — PSR T Power Supply Noise Rejection Ratio PSR XD1 Digital Output Delay Time t XD2 t XD3 *1 The ...
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Semiconductor TIMING DIAGRAM PCM Data Input/Output Timing Transmit Timing BCLOCK XSYNC XD1 SD PCMOUT MSD D2 When t £ 1/2 • Fc, the Delay of the MSD ...
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Semiconductor APPLICATION CIRCUIT Analog interface 0.1 mF Analog input Analog output +3 FREQUENCY CHARACTERISTICS ADJUSTMENT CIRCUIT Microphone amp M C1 Receiver impedance to 1 MSM7541/7542 ...
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Semiconductor RECOMMENDATIONS FOR ACTUAL DESIGN • To assure proper electrical characteristics, use bypass capacitors with excellent high frequency characteristics for the power supply and keep them as close as possible to the device pins. • Connect the AG pin ...
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Semiconductor PACKAGE DIMENSIONS DIP20-P-300-2.54-S1 MSM7541/7542 (Unit : mm) Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating Solder plate thickness more Package weight (g) 1.49 TYP. 18/20 ...
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Semiconductor SOP24-P-430-1.27-K Mirror finish Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed ...
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Semiconductor TSOPII26/20-P-300-1.27-K Mirror finish Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed ...