msm7542 Oki Semiconductor, msm7542 Datasheet - Page 20

no-image

msm7542

Manufacturer Part Number
msm7542
Description
Single Rail Codec
Manufacturer
Oki Semiconductor
Datasheet
¡ Semiconductor
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
TSOPII26/20-P-300-1.27-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
MSM7541/7542
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.38 TYP.
(Unit : mm)
20/20

Related parts for msm7542