tpcp8406 TOSHIBA Semiconductor CORPORATION, tpcp8406 Datasheet - Page 3

• Manufacturer Part Number: tpcp8406
• Description: Mosfets Silicon P-/n-channel Mos U-mos?/u-mos?-h
• Manufacturer: TOSHIBA Semiconductor CORPORATION

5. 5. 5. 5. Thermal Characteristics
Thermal Characteristics
Thermal Characteristics
Thermal Characteristics
Note 1: Ensure that the channel temperature does not exceed 150.
Note 2: Device mounted on a glass-epoxy board (a), Figure 5.1
Note 3: Device mounted on a glass-epoxy board (b), Figure 5.2
Note 4: Power dissipation and thermal resistance values per device with the other device being off (During single
Note 5: Power dissipation and thermal resistance values per device for dual operation (During dual operation, power
Note 6: P channel: V
Note:
Channel-to-ambient thermal resistance (single
operation)
Channel-to-ambient thermal resistance (per device for
dual operation)
Channel-to-ambient thermal resistance (single
operation)
Channel-to-ambient thermal resistance (per device for
dual operation)
Fig.
Fig.
Fig.
Fig. 5.1
operation, power is supplied to only one of the two devices.)
is evenly supplied to both devices.)
N channel: V
This transistor is sensitive to electrostatic discharge and should be handled with care.
5.1
5.1
5.1 Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
DD
DD
= -32 V, T
Board (a)
Board (a)
Board (a)
= 32 V, T
Board (a)
ch
ch
= 25 (initial), L = 0.2 mH, R
Characteristics
= 25 (initial), L = 0.2 mH, R
3
(t = 5 s)
(t = 5 s)
(t = 5 s)
(t = 5 s)
Fig.
Fig.
Fig.
Fig. 5.2
G
G
5.2
5.2
5.2 Device Mounted on a Glass-Epoxy
= 25 Ω, I
= 25 Ω, I
(Note 2), (Note 4)
(Note 2), (Note 5)
(Note 3), (Note 4)
(Note 3), (Note 5)
Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
AR
AR
= 6 A
= -5 A
Board (b)
Board (b)
Board (b)
Board (b)
R
R
R
R
Symbol
th(ch-a)(1)
th(ch-a)(2)
th(ch-a)(1)
th(ch-a)(2)
TPCP8406
101.6
215.5
347.2
84.5
Max
2011-03-14
Rev.2.0
/W
Unit