HEF40098BT,653 NXP Semiconductors, HEF40098BT,653 Datasheet
HEF40098BT,653
Specifications of HEF40098BT,653
HEF40098BTD-T
HEF40098BTD-T
Related parts for HEF40098BT,653
HEF40098BT,653 Summary of contents
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HEF40098B Hex inverting buffer; 3-state Rev. 06 — 24 June 2009 1. General description The HEF40098B is a hex inverting buffer with 3-state outputs. The 3-state outputs are controlled by two active LOW enable inputs (1OE and 2OE). A HIGH ...
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... NXP Semiconductors 5. Functional diagram 2 1A0 4 1A1 6 1A2 10 1A3 1 1OE 14 2A0 12 2A1 15 2OE Fig 1. Functional diagram 6. Pinning information 6.1 Pinning Fig 3. Pin configuration HEF40098B_6 Product data sheet 1Y0 3 1Y1 5 1Y2 7 1Y3 9 2Y0 13 2Y1 11 001aae553 Fig 2. HEF40098B 1OE 1 2 1A0 1Y0 3 1A1 ...
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... NXP Semiconductors 6.2 Pin description Table 2. Pin description Symbol Pin 1OE 1 1A0, 1A1, 1A2, 1A3 1Y0, 1Y1, 1Y2, 1Y3 2Y0, 2Y1 13, 11 2A0, 2A1 14, 12 2OE Functional description [1] Table 3. Function table Inputs nAn [ HIGH voltage level LOW voltage level don’t care high-impedance OFF state. ...
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... NXP Semiconductors 9. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter V supply voltage DD V input voltage I T ambient temperature amb t/ V input transition rise and fall rate 10. Static characteristics Table 6. Static characteristics unless otherwise specified Symbol Parameter V HIGH-level input voltage ...
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... NXP Semiconductors 11. Dynamic characteristics Table 7. Dynamic characteristics for test circuit see SS amb Symbol Parameter t HIGH to LOW PHL propagation delay t LOW to HIGH PLH propagation delay t HIGH to LOW output THL transition time t LOW to HIGH output TLH transition time t HiGH to OFF-state PHZ propagation delay ...
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... NXP Semiconductors 12. AC waveforms Measurement points are given in Fig 4. Input (nAn) to output (nYn) propagation delays nOE input nYn output LOW-to-OFF OFF-to-LOW nYn output HIGH-to-OFF OFF-to-HIGH Measurement points are given in Fig 5. 3-state enable and disable times Table 9. Measurement points Supply voltage Input ...
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... NXP Semiconductors Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance External voltage for measuring switching times. EXT Fig 6. Test circuitry for switching times Table 10. Test data ...
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... NXP Semiconductors 13. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors 14. Revision history Table 11. Revision history Document ID Release date HEF40098B_6 20090624 • Modifications: Title changed. • Section 2 • Section 8 “Limiting • Applications section removed. • Section 15 “Legal _5 HEF40098B 20081031 HEF40098B_4 20080731 HEF40098B_CNV_3 19950101 HEF40098B_CNV_2 19950101 HEF40098B_6 Product data sheet ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 Revision history ...