q67050-a4134-a001 Infineon Technologies Corporation, q67050-a4134-a001 Datasheet
q67050-a4134-a001
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q67050-a4134-a001 Summary of contents
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... 2.6 x 2.6 mm suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIGC07T60NC G Package Ordering Code Q67050-A4134- sawn on foil A001 2.6 x 2.6 6.76 / 4.3 1.11 x 1.78 0.5 x 0.7 100 150 0 2249 Photoimide 3200 1400 – ...
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MAXIMUM RATINGS: Parameter Collector-emitter voltage = collector current, limited by T Pulsed collector current, t limited Gate emitter voltage Operating junction and storage temperature 1 ) depending on thermal properties of assembly STATIC ...
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CHIP DRAWING: Edited by INFINEON Technologies HV3, L 7212-M, Edition 2, 28.11.2003 SIGC07T60NC ...
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FURTHER ELECTRICAL CHARACTERISTICS: This chip data sheet refers to the device data sheet Description: AQL 0,65 for visual inspection according to failure catalog Electrostatic Discharge Sensitive Device according to MIL-STD 883 Test-Normen Villach/Prüffeld Published by Infineon Technologies AG, Bereich Kommunikation ...