q67050-a4151-a001 Infineon Technologies Corporation, q67050-a4151-a001 Datasheet
q67050-a4151-a001
Related parts for q67050-a4151-a001
q67050-a4151-a001 Summary of contents
Page 1
... Ni Ag –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder 0.65mm ; max 1.2mm store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23° Ordering Code Q67050- sawn on foil A4151-A001 190 µm 150 mm ...
Page 2
MAXIMUM RATINGS: Parameter Collector-emitter voltage = collector current, limited by T jmax Pulsed collector current, t limited Gate emitter voltage Operating junction and storage temperature 1 ) depending on thermal properties of assembly ...
Page 3
CHIP DRAWING: Edited by INFINEON Technologies HV3, L 7751-A, Edition 2, 04.09.03 SIGC42T170R3 ...
Page 4
FURTHER EL ECTRICAL CHARACTERISTICS: This chip data sheet refers to the device data sheet DESCRIPTION: AQL 0,65 for visual inspection according to failure catalog Electrostatic Discharge Sensitive Device according to MIL-STD 883 Test-Normen Villach/Prüffeld Published by Infineon Technologies AG, Bereich ...