MPC8247 MOTOROLA [Motorola, Inc], MPC8247 Datasheet - Page 14

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MPC8247

Manufacturer Part Number
MPC8247
Description
MPC8272 PowerQUICC II Family Hardware Specifications
Manufacturer
MOTOROLA [Motorola, Inc]
Datasheet

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Power Dissipation
Power Dissipation
5
Table 7 provides preliminary, estimated power dissipation for various configurations. Note that suitable
thermal management is required to ensure the junction temperature does not exceed the maximum specified
value. Also note that the I/O power should be included when determining whether to use a heat sink. For a
complete list of possible clock configurations, refer to Section 7, “Clock Configuration Modes.”
1
2
3
6
The following sections include illustrations and tables of clock diagrams, signals, and CPM outputs and
inputs for 66.67-/83.33-/100-MHz MPC8272 devices. Note that AC timings are based on a 50-pf load.
Typical output buffer impedances are shown in Table 8.
1
6.1
Table 9 lists CPM output characteristics.
14
60x bus
Memory controller
Parallel I/O
PCI
Test temperature = 105
P
Values do not include I/O. Add the following estimates for active I/O based on the following bus speeds:
66.7 MHz = 0.35 W (nominal), 0.4 W (maximum)
83.3 MHz = 0.4 W (nominal), 0.5 W (maximum)
100 MHz = 0.5 W (nominal), 0.6 W (maximum)
These are typical values at 65˚ C. Impedance may vary by ±25% with process and temperature.
INT
= I
(MHz)
66.67
Bus
100
100
DD
Power Dissipation
AC Electrical Characteristics
x V
CPM AC Characteristics
DD
Table 7. Estimated Power Dissipation for Various Configurations
Watts
MPC8272 PowerQUICC II™ Family Hardware Specifications
Output Buffers
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Multiplication
˚
C)
Factor
CPM
Freescale Semiconductor, Inc.
3
2
2
For More Information On This Product,
Table 8. Output Buffer Impedances
Go to: www.freescale.com
(MHz)
CPM
200
200
200
Multiplication
Factor
CPU
4
3
4
(MHz)
CPU
Typical Impedance ( )
266
300
400
1
45
45
45
25
Nominal
0.75
0.85
1
Vddl 1.5 Volts
1
P
INT
(W)
MOTOROLA
Maximum
2, 3
1.05
0.8
0.9

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