K6T0808C1D-B Samsung semiconductor, K6T0808C1D-B Datasheet - Page 5

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K6T0808C1D-B

Manufacturer Part Number
K6T0808C1D-B
Description
32Kx8 bit Low Power CMOS Static RAM
Manufacturer
Samsung semiconductor
Datasheet
DATA RETENTION CHARACTERISTICS
AC CHARACTERISTICS
1. The parameter is tested with 50pF test load.
AC OPERATING CONDITIONS
TEST CONDITIONS
K6T0808C1D Family
Input pulse level : 0.8 to 2.4V
Input rising and falling time : 5ns
Input and output reference voltage : 1.5V
Output load (See right) :C
Vcc for data retention
Data retention current
Data retention set-up time
Recovery time
Read
Write
Read cycle time
Address access time
Chip select to output
Output enable to valid output
Chip select to low-Z output
Output enable to low-Z output
Chip disable to high-Z output
Output disable to high-Z output
Output hold from address change
Write cycle time
Chip select to end of write
Address set-up time
Address valid to end of write
Write pulse width
Write recovery time
Write to output high-Z
Data to write time overlap
Data hold from write time
End write to output low-Z
Item
(Test Load and Test Input/Output Reference)
Parameter List
C
L
L
=50pF+1TTL
=100pF+1TTL
(Vcc=4.5~5.5V, K6T0808C1D-L Family:T
Symbol
V
I
t
t
DR
SDR
RDR
DR
CS Vcc-0.2V
Vcc=3.0V, CS Vcc-0.2V
See data retention waveform
Test Condition
Symbol
t
t
t
t
t
t
t
t
t
t
WHZ
t
t
t
t
t
t
OHZ
t
t
t
OLZ
WC
CW
AW
WP
WR
DW
OW
RC
CO
OE
OH
DH
AA
HZ
AS
LZ
A
=0 to 70 C, K6T0808C1D-P Family:T
1. Including scope and jig capacitance
C
L-Ver
LL-Ver
Min
L
55
10
10
55
45
45
40
25
1)
5
0
0
0
0
0
0
5
-
-
-
55
1)
ns
Max
Speed Bins
55
55
25
20
20
20
Min
-
-
-
-
-
-
-
-
-
-
-
-
-
2.0
0
5
-
-
Min
CMOS SRAM
70
10
10
70
60
60
50
30
Typ
0.2
5
0
0
0
0
0
0
5
-
-
-
1
-
-
-
70ns
Max
Max
November 1997
A
70
70
35
30
30
25
5.5
15
=-40 to 85 C)
-
-
-
-
-
-
-
-
-
-
-
-
-
3
-
-
Revision 1.0
Units
Unit
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
V
A

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