K7R640982M Samsung semiconductor, K7R640982M Datasheet

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K7R640982M

Manufacturer Part Number
K7R640982M
Description
2Mx36 & 4Mx18 & 8Mx9 QDRTM II b2 SRAM
Manufacturer
Samsung semiconductor
Datasheet

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K7R640982M-EC25
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K7R321884M
Document Title
K7R323684M
Revision History
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
1Mx36-bit, 2Mx18-bit QDR
Rev. No.
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
2.0
History
1. Initial document.
1. Package dimension modify.
1. Pin name change from DLL to Doff.
2. Vddq range change from 1.5V to 1.5V~1.8V.
3. Update JTAG test conditions.
4. Reserved pin for high density name change from NC to Vss/SA
5. Delete AC test condition about Clock Input timing Reference Level
6. Delete clock description on page 2 and add HSTL I/O comment
1. Update current characteristics in DC electrical characteristics
2. Change AC timing characteristics
3. Update JTAG instruction coding and diagrams
1. Add -FC25 part(AC Characteristics)
2. Add AC electrical characteristics.
3. Change AC timing characteristics
4. Change DC electrical characteristics(I
1. Change the data Setup/Hold time.
2. Change the Access Time.(tCHQV, tCHQX, etc.)
3. Change the Clock Cycle Time.(MAX value of tKHKH)
4. Change the JTAG instruction coding.
1. Change the Boundary scan exit order.
2. Change the AC timing characteristics(-25, -20)
3. Correct the Overshoot and Undershoot timing diagrams.
1. Change the JTAG Block diagram
1. Correct the JTAG ID register definition
2. Correct the AC timing parameter (delete the tKHKH Max value)
3. Change the Isb1 current
1. Change the Maximum Clock cycle time.
2. Correct the 165FBGA package ball size.
1. Final spec release
1. Delete the x8 Org. part
P.20 from 13mmx15mm to 15mmx17mm
TM
II b4 SRAM
SB1
)
- 1 -
1Mx36 & 2Mx18 QDR
June 30, 2001
Oct. 20, 2001
Dec. 5, 2001
July, 29. 2002
Sep. 6. 2002
Oct. 7. 2002
Dec. 16, 2002
Dec. 26, 2002
Mar. 20, 2003
April. 4, 2003
Aug. 28, 2003
Dec. 1, 2003
Draft Date
TM
II b4 SRAM
Advance
Advance
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Final
Final
Remark
Dec. 2003
Rev 2.0

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K7R640982M Summary of contents

Page 1

... SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques- tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters. 1Mx36 & 2Mx18 QDR SRAM ) SB1 - SRAM Draft Date Remark Advance June 30, 2001 Advance Oct. 20, 2001 Preliminary Dec. 5, 2001 Preliminary July, 29 ...

Page 2

... K K CLK GEN C C Notes: 1. Numbers are for x18 device QDR SRAM and Quad Data Rate comprise a new family of products developed by Cypress, Hitachi, IDT, Micron, NEC and Samsung techno logy. 1Mx36 & 2Mx18 QDR II b4 SRAM TM Organization X36 X18 72(or 36) ...

Page 3

... PIN NUMBERS 6B, 6A 6P, 6R 11A 7B,7A,5A,5B 2H,10H 11H 8M,4N,8N 10R 11R 2R 1R 3A,6C voltage. output impedance is set to minimum value and it cannot be connected to ground or left unconnected SRAM /SA D17 Q17 D16 ...

Page 4

... D9:D17. 1 PIN NUMBERS 6B, 6A 6P, 6R 11A 3F,2G,3J,3L,3M,2N 2F,3G,3K,2L,3N, 7B, 5A 2H,10H 11H 10R 11R 2R 1R voltage. output impedance is set to minimum value and it cannot be connected to ground or left unconnected SRAM /SA ...

Page 5

... Memory bandwidth is maxmized as data can be transfered into sram on every rising edge of K and K , and transfered out of sram on every rising edge of C and C. And totally independent read and write ports eliminate the need for high speed bus turn around. ...

Page 6

... In all cases impedance updates are transparent to the user and do not produce access time "push-outs" or other anomalous behavior in the SRAM. There are no power up requirements for the SRAM. However, to guarantee optimum output driver impedance after power up, the SRAM needs 1024 non-read cycles. Single Clock Mode The K7R323684M and K7R321884M can be operated with the single clock pair K and K, insted for output clocks ...

Page 7

... State machine control timing sequence is controlled by K. 1Mx36 & 2Mx18 QDR STATE DIAGRAM POWER-UP READ WRITE READ WRITE READ D count=2 D count=2 ALWAYS ALWAYS - SRAM WRITE NOP WRITE WRITE LOAD NEW D count=2 WRITE ADDRESS D count=0 ALWAYS DDR WRITE D count=D count+1 WRITE D count=1 INCREMENT WRITE ADDRESS Dec ...

Page 8

... SRAM Q OPERATION Q(A2) Q(A3) Q(A4) Previous Previous Previous Clock Stop state state state High-Z High-Z High-Z No Operation OUT OUT OUT at C(t+2) at C(t+2) at C(t+ OPERATION WRITE ALL BYTEs ( K ...

Page 9

... 350 . RQ 350 . . DDQ 50mV. The levels are defined separately for measuring 3ns). V +0.85V(pulse width 3ns). DDQ - SRAM RATING -0.5 to 2 0.3 DD+ -65 to 150 - + MIN MAX - -25 - 800 ...

Page 10

... DDQ V REF V SS Symbol Value Unit V 1.7~1 1.4~1.9 V DDQ V /V 1.25/0. 0.75 V REF T /T 0.3/0 DDQ - SRAM = + MAX UNIT MIN REF - V - 0.2 V REF or V IL(AC) IH(AC IL(DC) IH(DC -0.25V -0.5V 20% t (MIN) KHKH MIN MAX 1.7 1.9 1.4 1.9 0.68 ...

Page 11

... The specs as shown do not imply bus contention beacuse tCHQX (0 C, 1.9V) than tCHQZ, which is a MAX parameter(worst case 1.7V not possible for two SRAMs on the same board such different voltage and temperature. 5. Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge. ...

Page 12

... C V =0V OUT OUT C - CLK and V =1.5V. DDQ SYMBOL R=250 SRAM Vt=V REF - SRAM TYP MAX Unit NOTES TYP Unit NOTES SRAM ...

Page 13

... QHQV CHCQV WRITE KLKH AVKH KHIX D1-1 D1-2 D1-3 D1 SRAM NOP NOP Q1-4 Q2-1 Q2-2 Q2-3 CHCQV t CHCQX Don t Care NOP D2-1 D2-2 D2-3 D2 DVKH KHDX Don t Care Q2-4 t CHQZ Undefined NOP Undefined Dec. 2003 ...

Page 14

... W R D(Data In) D(Data Out Note address A3=A2, data Q3-1=D2-1, data Q3-2=D2-2 , data Q3-3=D2-3, data Q3-4=D2-4 Write data is forwarded immediately as read results. 2.BWx ( NWx ) assumed active. 1Mx36 & 2Mx18 QDR WRITE READ A2 A3 D2-1 D2-2 Q1-1 Q1 SRAM WRITE NOP A4 D2-3 D2-4 D4-1 D4-2 Q1-3 Q1-4 Q3-1 Q3-2 Don t Care NOP D4-3 Q3-3 Undefined Dec. 2003 Rev 2.0 ...

Page 15

... This is to support connectivity testing during manufacturing and system diagnostics. Internal data is not driven out of the SRAM under JTAG control. In conformance with IEEE 1149.1, the SRAM contains a TAP controller, Instruction Reg- ister, Bypass Register and ID register. The TAP controller has a standard 16-state machine that resets internally upon power-up, therefore, TRST signal is not required ...

Page 16

... SRAM Boundary Scan 109 bits 109 bits Start Bit(0) (11 ORDER PIN ...

Page 17

... Output High Voltage(I =-2mA) OH Output Low Voltage(I =2mA) OL Note: 1. The input level of SRAM pin is to follow the SRAM DC specification JTAG AC TEST CONDITIONS Parameter Input High/Low Level Input Rise/Fall Time Input and Output Timing Reference Level Note: 1. See SRAM AC test output load on page 11. ...

Page 18

... Body, 1.0mm Bump Pitch, 11x15 Ball Array Symbol Value Units 0.1 C 1.3 0.1 D 0.35 0.05 1Mx36 & 2Mx18 QDR Note Symbol SRAM B Top View Side View D E Bottom View H Value Units Note 1.0 mm 14.0 mm 10.0 mm 0.5 0.05 mm Dec. 2003 Rev 2.0 ...

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