MT49H8M36FM-33 IT Micron Semiconductor Products, MT49H8M36FM-33 IT Datasheet

MT49H8M36FM-33 IT

Manufacturer Part Number

MT49H8M36FM-33 IT

Description

Manufacturer

Micron Semiconductor Products

Datasheet

1.MT49H16M18FM-5-IT.pdf (76 pages)

Current page: 1 of 76
Download datasheet (3Mb)

CIO RLDRAM

MT49H32M9 – 32 Meg x 9 x 8 Banks

MT49H16M18 – 16 Meg x 18 x 8 Banks

MT49H8M36 – 8 Meg x 36 x 8 Banks

Features

• 400 MHz DDR operation (800 Mb/s/pin data rate)

• 28.8 Gb/s peak bandwidth (x36 at 400 MHz

• Organization

• 8 internal banks for concurrent operation and

• Reduced cycle time (20ns at 400 MHz)

• Nonmultiplexed addresses (address multiplexing

• SRAM-type interface

• Programmable READ latency (RL), row cycle time,

• Balanced READ and WRITE latencies in order to

• Data mask for WRITE commands

• Differential input clocks (CK, CK#)

• Differential input data clocks (DKx, DKx#)

• On-die DLL generates CK edge-aligned data and

• Data valid signal (QVLD)

• 32ms refresh (8K refresh for each bank; 64K refresh

• 144-ball µBGA package

• HSTL I/O (1.5V or 1.8V nominal)

• 25–60Ω matched impedance outputs

• 2.5V V

• On-die termination (ODT) R

PDF: 09005aef80a41b59/Source: 09005aef809f284b

288Mb_RLDRAM_II_CIO_D1.fm - Rev N 5/08 EN

clock frequency)

– 32 Meg x 9, 16 Meg x 18, and 8 Meg x 36

maximum bandwidth

option available)

and burst sequence length

optimize data bus utilization

output data clock signals

command must be issued in total each 32ms)

EXT

, 1.8V V

Products and specifications discussed herein are subject to change by Micron without notice.

, 1.5V or 1.8V V

288Mb: x9, x18, x36 2.5V V

Q I/O

Figure 1:

Notes: 1. Contact Micron for availability of industrial

Options

• Clock cycle timing

• Configuration

• Operating temperature

• Package

– 2.5ns (400 MHz)

– 3.3ns (300 MHz)

– 5ns (200 MHz)

– 32 Meg x 9

– 16 Meg x 18

– 8 Meg x 36

– Commercial (0° to +95°C)

– Industrial (T

– 144-ball µBGA

– 144-ball µBGA (Pb-free)

– 144-ball FBGA

– 144-ball FBGA (Pb-free)

Micron Technology, Inc., reserves the right to change products or specifications without notice.

2. Contact Micron for availability of Pb-free

3. The FBGA package is being phased out.

= –40°C to +85°C)

EXT

temperature products.

products.

, 1.8V V

144-Ball µBGA

= –40°C to +95°C;

, HSTL, CIO, RLDRAM II

Marking

16M18

Features

32M9

8M36

None

-25

-33

-5

2, 3

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