MT47H256M8EB-25EIT:C

Manufacturer Part NumberMT47H256M8EB-25EIT:C
Description
ManufacturerMicron Semiconductor Products
MT47H256M8EB-25EIT:C datasheet
 


Specifications of MT47H256M8EB-25EIT:C

Pack_quantity171Comm_code85423239
Lead_time56EccnEAR99
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DDR2 SDRAM
MT47H512M4 – 64 Meg x 4 x 8 banks
MT47H256M8 – 32 Meg x 8 x 8 banks
MT47H128M16 – 16 Meg x 16 x 8 banks
Features
• V
= 1.8V ±0.1V, V
= 1.8V ±0.1V
DD
DDQ
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Duplicate output strobe (RDQS) option for x8
• DLL to align DQ and DQS transitions with CK
• 8 internal banks for concurrent operation
• Programmable CAS latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1
• Programmable burst lengths: 4 or 8
• Adjustable data-output drive strength
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
• Industrial temperature (IT) option
• RoHS-compliant
• Supports JEDEC clock jitter specification
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN
Products and specifications discussed herein are subject to change by Micron without notice.
Options
• Configuration
– 512 Meg x 4 (64 Meg x 4 x 8 banks)
– 256 Meg x 8 (32 Meg x 8 x 8 banks)
– 128 Meg x 16 (16 Meg x 16 x 8 banks)
• FBGA package (Pb-free) – x16
– 84-ball FBGA (11.5mm x 14mm) Rev. A
• FBGA package (Pb-free) – x4, x8
– 60-ball FBGA (11.5mm x 14mm) Rev. A
• FBGA package (Pb-free) – x16
– 84-ball FBGA (9mm x 12.5mm) Rev. C
• FBGA package (Pb-free) – x4, x8
t
– 60-ball FBGA (9mm x 11.5mm) Rev. C
CK
• FBGA package (Lead solder) – x16
– 84-ball FBGA (9mm x 12.5mm) Rev. C
• Timing – cycle time
– 1.875ns @ CL = 7 (DDR2-1066)
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6 (DDR2-800)
– 3.0ns @ CL = 5 (DDR2-667)
• Self refresh
– Standard
• Operating temperature
– Commercial (0°C T
– Industrial (–40°C T
–40°C T
• Revision
Note:
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2Gb: x4, x8, x16 DDR2 SDRAM
1
+85°C)
C
+95°C;
C
+85°C)
A
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on
www.micron.com
product offerings and availability.
‹ 2006 Micron Technology, Inc. All rights reserved.
Features
Marking
512M4
256M8
128M16
HG
HG
RT
EB
PK
-187E
-25E
-25
-3
None
None
IT
:A/:C
for