MT47H256M8EB-25EIT:C Micron Semiconductor Products, MT47H256M8EB-25EIT:C Datasheet

MT47H256M8EB-25EIT:C

Manufacturer Part Number

MT47H256M8EB-25EIT:C

Description

Manufacturer

Micron Semiconductor Products

Datasheet

1.MT47H256M8EB-25EITC.pdf (134 pages)

Specifications of MT47H256M8EB-25EIT:C

Pack_quantity

171

Comm_code

85423239

Lead_time

Eccn

EAR99

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MT47H256M8EB-25EIT:CTR

Manufacturer:

Quantity:

56 000

Current page: 1 of 134
Download datasheet (3Mb)

DDR2 SDRAM

MT47H512M4 – 64 Meg x 4 x 8 banks

MT47H256M8 – 32 Meg x 8 x 8 banks

MT47H128M16 – 16 Meg x 16 x 8 banks

Features

• V

• JEDEC-standard 1.8V I/O (SSTL_18-compatible)

• Differential data strobe (DQS, DQS#) option

• 4n-bit prefetch architecture

• Duplicate output strobe (RDQS) option for x8

• DLL to align DQ and DQS transitions with CK

• 8 internal banks for concurrent operation

• Programmable CAS latency (CL)

• Posted CAS additive latency (AL)

• WRITE latency = READ latency - 1

• Programmable burst lengths: 4 or 8

• Adjustable data-output drive strength

• 64ms, 8192-cycle refresh

• On-die termination (ODT)

• Industrial temperature (IT) option

• RoHS-compliant

• Supports JEDEC clock jitter specification

PDF: 09005aef824f87b6

2Gb_DDR2.pdf – Rev. H 10/11 EN

= 1.8V ±0.1V, V

Products and specifications discussed herein are subject to change by Micron without notice.

DDQ

= 1.8V ±0.1V

Options

• Configuration

• FBGA package (Pb-free) – x16

• FBGA package (Pb-free) – x4, x8

• FBGA package (Pb-free) – x16

• FBGA package (Pb-free) – x4, x8

• FBGA package (Lead solder) – x16

• Timing – cycle time

• Self refresh

• Operating temperature

• Revision

– 512 Meg x 4 (64 Meg x 4 x 8 banks)

– 256 Meg x 8 (32 Meg x 8 x 8 banks)

– 128 Meg x 16 (16 Meg x 16 x 8 banks)

– 84-ball FBGA (11.5mm x 14mm) Rev. A

– 60-ball FBGA (11.5mm x 14mm) Rev. A

– 84-ball FBGA (9mm x 12.5mm) Rev. C

– 60-ball FBGA (9mm x 11.5mm) Rev. C

– 84-ball FBGA (9mm x 12.5mm) Rev. C

– 1.875ns @ CL = 7 (DDR2-1066)

– 2.5ns @ CL = 5 (DDR2-800)

– 2.5ns @ CL = 6 (DDR2-800)

– 3.0ns @ CL = 5 (DDR2-667)

– Standard

– Commercial (0°C T

– Industrial (–40°C T

Note:

–40°C T

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on

product offerings and availability.

2Gb: x4, x8, x16 DDR2 SDRAM

+85°C)

+95°C;

+85°C)

www.micron.com

Features

Marking

128M16

for

512M4

256M8

-187E

None

:A/:C

-25E

-25

-3

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