K4T1G044QF SAMSUNG [Samsung semiconductor], K4T1G044QF Datasheet - Page 8

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K4T1G044QF

Manufacturer Part Number
K4T1G044QF
Description
1Gb F-die DDR2 SDRAM
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
K4T1G044QF
K4T1G084QF
K4T1G164QF
3.4 FBGA Package Dimension (x4/x8)
(Post reflow 0.50 ± 0.05)
60-∅0.48 Solder ball
0.2 M A B
(Datum A)
(Datum B)
#A1
G
A
B
C
D
E
F
H
K
L
J
9
8
0.80
datasheet
BOTTOM VIEW
7
0.80 x 8 = 6. 40
TOP VIEW
7.50 ± 0.10
7.50 ± 0.10
6
(0.60)
5
1.60
(0.30)
4
3.20
3
2
- 8 -
MOLDING AREA
1
A
# A1 INDEX MARK
B
Units : Millimeters
0.37±0.05
1.10±0.10
DDR2 SDRAM
Rev. 1.11

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