EDD1216AATA-5 ELPIDA [Elpida Memory], EDD1216AATA-5 Datasheet

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EDD1216AATA-5

Manufacturer Part Number
EDD1216AATA-5
Description
128M bits DDR SDRAM (8M words x 16 bits, DDR400)
Manufacturer
ELPIDA [Elpida Memory]
Datasheet

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Description
The EDD1216AATA is a 128M bits Double Data Rate
(DDR) SDRAM organized as 2,097,154 words
the cross points of the CK and the /CK. This high-
speed data transfer is realized by the 2 bits prefetch-
pipelined architecture.
read and write are available for high speed and reliable
data bus design. By setting extended mode register,
the on-chip Delay Locked Loop (DLL) can be set
enable or disable.
TSOP (II).
Features
Document No. E0443E40 (Ver. 4.0)
Date Published October 2005 (K) Japan
Printed in Japan
URL: http://www.elpida.com
Power supply: VDD ,VDDQ = 2.6V
Data rate: 400Mbps (max.)
Double Data Rate architecture; two data transfers per
clock cycle
Bi-directional, data strobe (DQS) is transmitted
/received with data, to be used in capturing data at
the receiver
Data inputs, outputs, and DM are synchronized with
DQS
4 internal banks for concurrent operation
DQS is edge aligned with data for READs; center
aligned with data for WRITEs
transitions
and data mask referenced to both edges of DQS
Data mask (DM) for write data
Auto precharge option for each burst access
SSTL_2 compatible I/O
Programmable burst length (BL): 2, 4, 8
Programmable /CAS latency (CL): 3
Programmable output driver strength: normal/weak
Refresh cycles: 4096 refresh cycles/64ms
2 variations of refresh
TSOP (II) package with lead free solder (Sn-Bi)
4 banks. Read and write operations are performed at
Differential clock inputs (CK and /CK)
DLL aligns DQ and DQS transitions with CK
Commands entered on each positive CK edge; data
15.6 s maximum average periodic refresh interval
Auto refresh
Self refresh
RoHS compliant
EDD1216AATA-5 (8M words 16 bits, DDR400)
It is packaged in 66-pin plastic
Data strobe (DQS) both for
128M bits DDR SDRAM
0.1V
DATA SHEET
16 bits
Pin Configurations
/xxx indicates active low signal.
A0 to A11
BA0, BA1
DQ0 to DQ15
UDQS/LDQS
/CS
/RAS
/CAS
/WE
UDM/LDM
CK
/CK
CKE
VREF
VDD
VSS
VDDQ
VSSQ
NC
A10(AP)
VDDQ
VDDQ
VDDQ
VSSQ
VSSQ
LDQS
/CAS
/RAS
VDD
VDD
LDM
VDD
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
/WE
BA0
BA1
/CS
NC
NC
NC
NC
A0
A1
A2
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
66-pin Plastic TSOP(II)
Address input
Bank select address
Data-input/output
Input and output data strobe
Chip select
Row address strobe command
Column address strobe command
Write enable
Input mask
Clock input
Differential clock input
Clock enable
Input reference voltage
Power for internal circuit
Ground for internal circuit
Power for DQ circuit
Ground for DQ circuit
No connection
(Top view)
Elpida Memory, Inc. 2003-2005
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
VSS
DQ15
VSSQ
DQ14
DQ13
VDDQ
DQ12
DQ11
VSSQ
DQ10
DQ9
VDDQ
DQ8
NC
VSSQ
UDQS
NC
VREF
VSS
UDM
/CK
CK
CKE
NC
NC
A11
A9
A8
A7
A6
A5
A4
VSS

Related parts for EDD1216AATA-5

EDD1216AATA-5 Summary of contents

Page 1

... DDR SDRAM EDD1216AATA-5 (8M words 16 bits, DDR400) Description The EDD1216AATA is a 128M bits Double Data Rate (DDR) SDRAM organized as 2,097,154 words 4 banks. Read and write operations are performed at the cross points of the CK and the /CK. This high- speed data transfer is realized by the 2 bits prefetch- pipelined architecture ...

Page 2

... Organization 16: x16 Power Supply, Interface A: 2.5V, SSTL_2 Die Rev. Data Sheet E0443E40 (Ver. 4.0) Internal Data rate JEDEC speed bin bits) banks Mbps (max.) (CL-tRCD-tRP) DDR400B (3-3-3) 4 400 DDR400C (3-4-4) 2 EDD1216AATA-5 Package 66-pin Plastic TSOP (II) Environment Code E: Lead Free Speed 5B: DDR400B (3-3-3) 5C: DDR400C (3-4-4) Package TA: TSOP (II) ...

Page 3

... CONTENTS Description.....................................................................................................................................................1 Features.........................................................................................................................................................1 Pin Configurations .........................................................................................................................................1 Ordering Information......................................................................................................................................2 Part Number ..................................................................................................................................................2 Electrical Specifications.................................................................................................................................4 Block Diagram .............................................................................................................................................10 Pin Function.................................................................................................................................................11 Command Operation ...................................................................................................................................13 Simplified State Diagram .............................................................................................................................20 Operation of the DDR SDRAM ....................................................................................................................21 Timing Waveforms.......................................................................................................................................39 Package Drawing ........................................................................................................................................45 Recommended Soldering Conditions..........................................................................................................46 Data Sheet E0443E40 (Ver. 4.0) EDD1216AATA-5 3 ...

Page 4

... +70 Tstg –55 to +125 min. typ. 2.5 2 0.49 VDDQ 0.50 VDDQ VREF – 0.04 VREF VREF + 0.15 — –0.3 — –0.3 — 0.5 VDDQ 0.2V 0.5 VDDQ 0.36 — 4 EDD1216AATA-5 Unit Note max. Unit Notes 2 0.51 VDDQ V VREF + 0.04 V VDDQ + 0 VREF – 0. VDDQ + 0 ...

Page 5

... Input ≤ 0.2 V 350 max. Unit Test condition 2 µA VDD ≥ VIN ≥ VSS 5 µA VDDQ ≥ VOUT ≥ VSS — mA VOUT = 1.95V — mA VOUT = 0.35V 5 EDD1216AATA-5 Notes Note ...

Page 6

... EDD1216AATA-5 max. Unit Notes VOUT = 0.2V, max. Unit Notes 0.55 tCK 0.55 tCK — tCK 0 ...

Page 7

... For each of the terms above, if not already an integer, round to the next highest integer. Example: For –5C Speed tCK = 5ns, tWR = 15ns and tRP= 18ns, tDAL = (15ns/5ns) + (18ns/5ns) = (3) + (4) tDAL = 7 clocks Data Sheet E0443E40 (Ver. 4.0) EDD1216AATA-5 -5B -5C min. max. min. ...

Page 8

... VTT VREF VIH (AC) VREF 0.31 VIL (AC) VREF 0.31 VID (AC) 0.62 VIX (AC) VREF SLEW 1 tCK tCL tCH VIX VDD VIH VREF VIL VSS t SLEW = (VIH (AC) – VIL (AC))/ t VTT 30pF Input Waveforms and Output Load 8 EDD1216AATA-5 Unit V/ns VDD VREF VSS ...

Page 9

... DM to data in latency Mode register set command cycle time Self refresh exit to non-read command Self refresh exit to read command Power down entry Power down exit to command input Data Sheet E0443E40 (Ver. 4.0) EDD1216AATA-5 Number of clock cycle 5ns Symbol min. max. — tWPD 4 + BL/2 — ...

Page 10

... Data Sheet E0443E40 (Ver. 4.0) Bank 1 Row address Memory cell array buffer Bank 0 and refresh counter Sense amp. Column decoder Column address buffer and burst Data control circuit counter Latch circuit DLL CK, /CK Input & Output buffer DQ 10 EDD1216AATA-5 Bank 3 Bank 2 DQS DM ...

Page 11

... BA0, BA1 are bank select signals (BA). The memory array is divided into bank 0, bank 1, bank 2 and bank 3. (See Bank Select Signal Table) [Bank Select Signal Table] BA0 Bank 0 L Bank 1 H Bank 2 L Bank 3 H Remark: H: VIH. L: VIL. Data Sheet E0443E40 (Ver. 4.0) EDD1216AATA-5 Column address AY0 to AY8 BA1 ...

Page 12

... VDD, VSS, VDDQ, VSSQ (Power supply) VDD and VSS are power supply pins for internal circuits. VDDQ and VSSQ are power supply pins for the output buffers. Data Sheet E0443E40 (Ver. 4.0) EDD1216AATA-5 16 products, LDM controls the lower byte (DQ0 to DQ7) and UDM 12 ...

Page 13

... L H PRE PALL REF SELF MRS EMRS EDD1216AATA-5 BA1 BA0 AP Address ...

Page 14

... Power down Power down exit (PDEX) Remark: H: VIH. L: VIL. : VIH or VIL. Notes: 1. All the banks must be in IDLE before executing this command. 2. The CKE level must be kept for 1 CK cycle at least. Data Sheet E0443E40 (Ver. 4.0) EDD1216AATA-5 BA1 CKE n – 1 ...

Page 15

... NOP NOP NOP BST ILLEGAL BA, CA, A10 READ/READA Starting read operation Read/READA BA, CA, A10 WRIT/WRITA Starting write operation BA, RA ACT ILLEGAL* BA, A10 PRE, PALL Pre-charge ILLEGAL 15 EDD1216AATA-5 Next state ldle ldle 11 — 11 — 11 — 11 — ldle — ldle ldle 11 — 11 — ...

Page 16

... NOP NOP BST ILLEGAL BA, CA, A10 READ/READA Starting read operation. Read/ReadA Starting new write BA, CA, A10 WRIT/WRITA operation. BA, RA ACT ILLEGAL* BA, A10 PRE/PALL ILLEGAL* ILLEGAL 16 EDD1216AATA-5 Next state Active Active Active Active 13 — 11 — Precharging — Precharging Precharging — 14 — 14 — ...

Page 17

... ILLEGAL* BA, CA, A10 WRIT/WRIT A ILLEGAL* BA, RA ACT ILLEGAL* BA, A10 PRE, PALL ILLEGAL* ILLEGAL Minimum delay (Concurrent AP supported) BL/2 CL(rounded up)+ (BL/ (BL/2) + tWTR BL EDD1216AATA-5 Next state Precharging Precharging — 14 — 14 — 11, 14 — 11, 14 — — Units tCK tCK tCK tCK tCK tCK ...

Page 18

... OPCODE Refer to operations in Function Truth Table Refer to operations in Function Truth Table Refer to operations in Function Truth Table H Refer to operations in Function Truth Table L H Self refresh L L OPCODE Refer to operations in Function Truth Table Power down Refer to operations in Function Truth Table Power down 18 EDD1216AATA-5 Notes Idle ...

Page 19

... DOUT timing by DLL. (200 cycles after [SELFX]) After the exit, input auto-refresh command within 15.6 s. Power down exit [PDEX] The DDR SDRAM can exit from power down mode tPDEX (1 cycle min.) after the cycle when [PDEX] is issued. Data Sheet E0443E40 (Ver. 4.0) EDD1216AATA-5 19 ...

Page 20

... Data Sheet E0443E40 (Ver. 4.0) SELF REFRESH SR ENTRY SR EXIT *1 MRS REFRESH AUTO IDLE REFRESH CKE CKE_ IDLE ACTIVE POWER CKE_ DOWN CKE ROW ACTIVE BST READ WRITE READ Read WITH WITH AP AP READ READ READ WITH AP READ WITH AP PRECHARGE READA PRECHARGE PRECHARGE PRECHARGE 20 EDD1216AATA-5 ...

Page 21

... REF REF RFC 200 cycles (min LMODE BT A3 Burst Type Sequential 1 Interleave 21 EDD1216AATA-5 (9) Any MRS command t 2 cycles (min.) RFC Disable DLL reset with A8 = Low Burst Length BT=0 BT ...

Page 22

... EDD1216AATA DLL A0 DLL Control 0 DLL Enable 1 DLL Disable Interleave ...

Page 23

... Data Sheet E0443E40 (Ver. 4.0) tCK + tAC (ns) after the clock rising READ NOP Column tRPRE out0 out1 out0 out1 out2 out3 out0 out1 out2 out3 out4 out5 out6 out7 Read Operation (Burst Length) 23 EDD1216AATA-5 t11 t9 t10 tRPST BL: Burst length ...

Page 24

... NOP tRPRE tAC,tDQSCK out0 out1 Read Operation (/CAS Latency) tn tn+0.5 tn+1 tn+2 tn+3 WRITE NOP Column tWPRE tWPRES in0 in1 tWPST in0 in1 in2 in3 in0 in1 in2 in3 in4 in5 Write Operation 24 EDD1216AATA-5 t4.5 t5 t5.5 tRPST VTT VTT out2 out3 tn+4 tn+5 in6 in7 BL: Burst length ...

Page 25

... High-Z. The BST command is not supported for the burst write operation. Note that bank address is not referred when this command is executed. t0 t0.5 CK /CK READ Command DQS Burst Stop during a Read Operation Data Sheet E0443E40 (Ver. 4.0) t1 t1.5 t2 t2.5 t3 t3.5 t4 BST NOP tBSTZ out0 out1 25 EDD1216AATA-5 t4.5 t5 t5.5 3 cycles CL: /CAS latency ...

Page 26

... Note: Internal auto-precharge starts at the timing indicated by " Data Sheet E0443E40 (Ver. 4.0) Refer to ‘Function truth table and related tRPD 2 cycles (= BL/2) READA NOP tAC,tDQSCK out0 out1 out2 ". Read with auto-precharge NOP BL cycles in1 in2 in3 in4 ". Burst Write ( EDD1216AATA-5 tRP (min) ACT out3 tRP ACT ...

Page 27

... ACT command. tRCD after the ACT command, the consecutive read command can be issued NOP READ Column B out out out Column = A Column = B Read Read Column = A Dout 27 EDD1216AATA-5 t9 t10 t11 out out out Column = B Dout Bank0 ...

Page 28

... Active READ to READ Command Interval (different bank) Data Sheet E0443E40 (Ver. 4. READ READ NOP Column A Column B Column = A Column = B Read Read Bank0 Bank3 Read Read 28 EDD1216AATA t10 t11 NOP out out out out out out Bank0 Bank3 ...

Page 29

... Precharge the bank without interrupting the preceding write operation. tRP after the precharge command, issue the ACT command. tRCD after the ACT command, the consecutive write command can be issued. tn+1 tn+2 tn+3 tn+4 WRIT Column B inA0 inA1 inB0 inB1 inB2 inB3 Column = A Column = B Write Write 29 EDD1216AATA-5 tn+5 tn+6 NOP Bank0 ...

Page 30

... ACT NOP ACT Row0 Row1 Address BA DQ DQS Bank0 Bank3 Active Active WRITE to WRITE Command Interval (different bank) Data Sheet E0443E40 (Ver. 4.0) tn tn+1 tn+2 NOP WRIT WRIT Column A Column B inA0 inA1 inB0 inB1 inB2 inB3 Bank0 Bank3 Write Write 30 EDD1216AATA-5 tn+3 tn+4 tn+5 NOP Bank0, 3 ...

Page 31

... Precharge the bank independently of the preceding read operation. tRP after the precharge command, issue the ACT command. tRCD after the ACT command, the consecutive write command can be issued WRIT NOP tBSTZ (= CL) out0 out1 in0 in1 OUTPUT READ to WRITE Command Interval 31 EDD1216AATA NOP in2 in3 INPUT ...

Page 32

... Precharge the bank independently of the preceding write operation. tRP after the precharge command, issue the ACT command. tRCD after the ACT command, the consecutive read command can be issued READ tWTR* in2 in3 WRITE to READ Command Interval 32 EDD1216AATA NOP out2 out0 out1 OUTPUT ...

Page 33

... DM must be input 1 cycle prior to the read command input to prevent from being written invalid data. In case, the read command is input in the next cycle of the write command not necessary. 1 — NOP CL=3 out0 out1 out2 out3 in2 33 EDD1216AATA High-Z High ...

Page 34

... Note: tWTR is referenced from the first positive CK edge after the last desired data in pair tWTR. [WRITE to READ delay = 3 clock cycle] Data Sheet E0443E40 (Ver. 4. NOP CL=3 in2 in3 out0 out1 out2 out3 READ CL=3 tWTR* in2 in3 34 EDD1216AATA High-Z High NOP out0 out1 out2 out3 ...

Page 35

... NOP READ DQ DQS READ to PRECHARGE Command Interval (same bank): To stop output data ( Data Sheet E0443E40 (Ver. 4. PRE/ NOP PALL out0 out1 out2 out3 PRE/PALL NOP out0 out1 tHZP 35 EDD1216AATA High-Z High-Z ...

Page 36

... Command WRIT DM DQS DQ in0 in1 Precharge Termination in Write Cycles (same bank) ( Data Sheet E0443E40 (Ver. 4. NOP tWPD tWR in2 in3 Last data input PRE/PALL NOP tWR in2 in3 Data masked 36 EDD1216AATA PRE/PALL NOP t6 t7 NOP ...

Page 37

... ACT command, the next ACT command can be issued. ACT NOP PRE ROW: 1 Bank3 Bank0 Active Precharge tRC Bank Active to Bank Active NOP ACT BS and ROW Bank3 Active tMRD 37 EDD1216AATA-5 NOP ACT NOP ROW: 0 Bank0 Active NOP ...

Page 38

... By setting DM to Low, data can be written. When DM is set to High, the corresponding data is not written, and the previous data is held. The latency between DM input and enabling/disabling mask function DQS DQ DM Data Sheet E0443E40 (Ver. 4. Mask Mask Write mask latency = 0 DM Control 38 EDD1216AATA ...

Page 39

... Data Sheet E0443E40 (Ver. 4.0) tIS tIH tIS tIH tDQSCK tDQSCK tDQSCK tDQSQ tQH tLZ tAC tAC tDQSQ tQH tDSS tDSH tDQSL tDQSH tDIPW tDH tDH tDIPW 39 EDD1216AATA-5 VREF VREF tDQSCK tRPST tDQSQ tQH tAC tHZ tDQSQ tQH tDSS VREF tWPST VREF VREF tDIPW ...

Page 40

... Bank 0 Bank 0 Bank 0 Read Read Precharge 40 EDD1216AATA-5 tRP tIS tIH tIS tIH tIS tIH tIS tIH tIS tIH tIS tIH tIS tIH tRPST Bank0 Access = VIH or VIL ...

Page 41

... Data Sheet E0443E40 (Ver. 4.0) tRC tRAS tDQSS tDQSL tWPST tDQSH tDS tDS tDS tDH tWR tDH 41 EDD1216AATA-5 tRP tIS tIH tIS tIH tIS tIH tIS tIH tIS tIH tIS tIH tIS tIH tIS tIH tIS tIH tIS tIH tIS tIH tIS tIH ...

Page 42

... Data Sheet E0443E40 (Ver. 4. tMRD Bank 3 Bank 3 Bank 3 Read Precharge Active R:b C tRWD Bank 3 Bank 3 Active Write 42 EDD1216AATA VIH or VIL C:b'' b’’ tWRD Bank 3 Read Read cycle =VIH or VIL ...

Page 43

... Auto Refresh Cycle /CK CK VIH CKE /CS /RAS /CAS /WE BA Address A10=1 DM DQS DQ (output) DQ (input) tRP Precharge If needed Data Sheet E0443E40 (Ver. 4. High-Z tRFC Auto Bank 0 Refresh Active 43 EDD1216AATA Bank 0 Read VIH or VIL ...

Page 44

... Self Refresh Cycle /CK CK tIS CKE /CS /RAS /CAS /WE BA Address A10=1 DM DQS DQ (output) DQ (input) tRP Precharge Self If needed refresh entry Data Sheet E0443E40 (Ver. 4.0) tIH CKE = low High-Z tSNR tSRD Self refresh Bank 0 exit Active 44 EDD1216AATA Bank 0 Read VIH or VIL ...

Page 45

... PIN 0.65 0.17 to 0.32 0. 0.91 max. 0. Note: This dimension does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.20mm per side. Data Sheet E0443E40 (Ver. 4. 8° 45 EDD1216AATA-5 Unit: mm 0.80 Nom 0.25 +0.15 0.60 −0.20 ECA-TS2-0143-01 ...

Page 46

... Recommended Soldering Conditions Please consult with our sales offices for soldering conditions of the EDD1216AATA. Type of Surface Mount Device EDD1216AATA: 66-pin Plastic TSOP (II) < Lead free(Sn-Bi) > Data Sheet E0443E40 (Ver. 4.0) EDD1216AATA-5 46 ...

Page 47

... Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. MOS devices are not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for MOS devices having reset function. Data Sheet E0443E40 (Ver. 4.0) EDD1216AATA-5 47 CME0107 ...

Page 48

... If these products/technology are sold, leased, or transferred to a third party third party is granted license to use these products, that third party must be made aware that they are responsible for compliance with the relevant laws and regulations. Data Sheet E0443E40 (Ver. 4.0) EDD1216AATA-5 48 M01E0107 ...

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