SPC5646CCF0MMJ1 Freescale Semiconductor, SPC5646CCF0MMJ1 Datasheet - Page 44

• Manufacturer Part Number: SPC5646CCF0MMJ1
• Description: 32-bit Microcontrollers - MCU 3M FLASH,25 6K RAM,CSE,12
• Manufacturer: Freescale Semiconductor

Specifications of SPC5646CCF0MMJ1

• Rohs: yes
• Core: e200
• Processor Series: MPC5646C
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 120 MHz
• Program Memory Size: 3 MB
• Data Ram Size: 256 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 0.3 V to 6.2 V
• Operating Temperature Range: - 40 C to + 125 C
• Package / Case: MAPBGA-256
• Mounting Style: SMD/SMT
• A/d Bit Size: 10 bit, 12 bit
• A/d Channels Available: 33
• Interface Type: CAN, I2C, SCI, SPI
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Number Of Programmable I/os: 199
• Number Of Timers: 32
• Program Memory Type: Flash
• Supply Voltage - Max: 6.2 V
• Supply Voltage - Min: 0.3 V

Electrical Characteristics
4.5
4.5.1
4.5.2
The average chip-junction temperature, T
44
1
2
3
4
5
6
7
1
2
3
R
R
R
Thermal characteristics are targets based on simulation that are subject to change per device characterization.
V
All values need to be confirmed during device validation.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6.
Junction-to-Ambient thermal resistance determined per JEDEC JESD51-2 and JESD51-6
Junction-to-Board thermal resistance determined per JEDEC JESD51-8.
Symbol
Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Junction-to-ambient thermal resistance determined per JEDEC JESD51-2 with the single layer board horizontal.
Board meets JESD51-9 specification.
Junction-to-ambient thermal resistance determined per JEDEC JESD51-6 with the board horizontal.
JA
JA
JA
Where:
DD
Symbol
Thermal characteristics
= 3.3 V ± 10% / 5.0 V ± 10%, T
T
R
P
P
P
Package thermal characteristics
CC
Power considerations
A
D
INT
I/O
JA
is the ambient temperature in °C.
is the sum of P
CC
CC
represents the power dissipation on input and output pins; user determined.
is the product of I
is the package junction-to-ambient thermal resistance, in °C/W.
— Thermal resistance, junction-to-ambient
C
natural convection
C
D
D
Thermal resistance,
junction-to-ambient
natural convection
Thermal resistance,
junction-to-ambient
natural convection
INT
Table 12. 256 MAPBGA thermal characteristics
and P
Parameter
DD
MPC5646C Microcontroller DataSheet, Rev. 5.1
Table 11. LQFP thermal characteristics
and V
I/O
J
Parameter
, in degrees Celsius, may be calculated using
A
(P
= 40 to 125 °C.
DD
D
T
= P
J
, expressed in watts. This is the chip internal power.
4
7
= T
INT
Single-layer
board—1s
Four-layer
board—2s2p
A
Conditions
+ P
+ (P
I/O
D
).

R
7
JA
2
)
Pin count
Single-layer board—1s
Four-layer board—2s2p
176
208
176
208
Conditions
Min
1
—
—
—
—
Equation
1
Value
Typ
—
—
—
—
1:
3
Value
43
26
2
3
Max
38
41
31
34
5
6
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
Unit
Freescale
Eqn. 1