FT240XS-U FTDI, FT240XS-U Datasheet - Page 35

• Manufacturer Part Number: FT240XS-U
• Description: USB Interface IC USB to Parallel FIFO IC SSOP-24
• Manufacturer: FTDI

Specifications of FT240XS-U

• Rohs: yes
• Tradename: X-Chip

9.5 Solder Reflow Profile
The FT240X is supplied in Pb free 24 LD SSOP and QFN-24 packages. The recommended solder reflow
profile for both package options is shown in 9.5.
Figure 9.5 FT240X Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 9.1. Values are shown for both
a completely Pb free solder process (i.e. the FT240X is used with Pb free solder), and for a non-Pb free
solder process (i.e. the FT240X is used with non-Pb free solder).
Table 9.1 Reflow Profile Parameter Values
Profile Feature
Preheat
- Temperature Min (T
- Temperature Max (T
- Time (t
Time Maintained Above Critical
Temperature T
- Temperature (T
- Time (t
Time within 5°C of actual Peak
Temperature (t
Time for T= 25°C to Peak Temperature,
T
Average Ramp Up Rate (T
Peak Temperature (T
Ramp Down Rate
p
s
L
)
Min to t
25
T
T
p
L
L
p
T Max
:
T Min
S
)
S
L
s
)
Max)
s
p
s
)
Min.)
Max.)
s
to T
Preheat
T = 25º C to T
Copyright © 2013 Future Technology Devices International Limited
Time, t (seconds)
p
)
t
S
P
Ramp Up
Pb Free Solder Process
3°C / second Max.
150°C
200°C
60 to 120 seconds
217°C
60 to 150 seconds
260°C
20 to 40 seconds
6°C / second Max.
8 minutes Max.
FT240X USB 8-BIT FIFO IC Datasheet
Document No.: FT_000626 Clearance No.:
t
p
t
L
Non-Pb Free Solder Process
3°C / Second Max.
100°C
150°C
60 to 120 seconds
183°C
60 to 150 seconds
240°C
20 to 40 seconds
6°C / second Max.
6 minutes Max.
Ramp
Down
Critical Zone: when
T is in the range
T to T
L
p
Version 1.3
FTDI# 259
35