W25Q80BVDAIG Winbond Electronics, W25Q80BVDAIG Datasheet - Page 63

• Manufacturer Part Number: W25Q80BVDAIG
• Description: SPI FLASH 8MBIT 8-DIP
• Manufacturer: Winbond Electronics

Specifications of W25Q80BVDAIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 8M (1M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10.4 DC Electrical Characteristics
Notes:
1. Tested on sample basis and specified through design and characterization data. TA = 25° C, VCC = 3V.
2. Checker Board Pattern.
PARAMETER
Input Capacitance
Output Capacitance
Input Leakage
I/O Leakage
Standby Current
Power-down Current
Current Read Data /
Dual /Quad 1MHz
Current Read Data /
Dual /Quad 33MHz
Current Read Data /
Dual /Quad 50MHz
Current Read Data /
Dual Output Read/Quad
Output Read 80MHz
Current Write Status
Register
Current Page Program
Current Sector/Block
Erase
Current Chip Erase
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
(2)
(2)
(2)
(2)
C
Cout
I
I
I
I
I
I
I
I
I
I
I
I
V
V
V
V
SYMBOL
LI
LO
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
IL
IH
OL
OH
IN (1)
1
2
3
3
3
3
4
5
6
7
(1)
CONDITIONS
V
V
/CS = VCC,
VIN = GND or VCC
/CS = VCC,
VIN = GND or VCC
C = 0.1 VCC / 0.9 VCC
DO = Open
C = 0.1 VCC / 0.9 VCC
DO = Open
C = 0.1 VCC / 0.9 VCC
DO = Open
C = 0.1 VCC / 0.9 VCC
DO = Open
/CS = VCC
/CS = VCC
/CS = VCC
/CS = VCC
I
I
OL
OH
IN
OUT
= 100 µA
= 0V
= –100 µA
= 0V
(1)
(1)
- 63 -
VCC – 0.2
VCC x 0.7
MIN
Publication Release Date: October 06, 2010
10/11/12
SPEC
4/5/6
6/7/8
7/8/9
TYP
25
20
20
20
1
8
W25Q80BV
10/12/13.5
15/16.5/18
VCC x 0.3
9/10.5/12
6/7.5/9
MAX
0.2
±2
±2
50
12
25
25
25
6
8
5
Revision D
UNIT
mA
mA
mA
mA
mA
mA
mA
mA
µA
µA
µA
µA
pF
pF
V
V
V
V