M24256-BWDW6TP STMicroelectronics, M24256-BWDW6TP Datasheet - Page 41

IC EEPROM 256KBIT 400KHZ 8TSSOP

M24256-BWDW6TP

Manufacturer Part Number
M24256-BWDW6TP
Description
IC EEPROM 256KBIT 400KHZ 8TSSOP
Manufacturer
STMicroelectronics
Datasheet

Specifications of M24256-BWDW6TP

Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
256K (32K x 8)
Speed
400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-TSSOP
Density
256Kb
Interface Type
Serial (I2C)
Organization
32Kx8
Access Time (max)
900ns
Frequency (max)
400KHz
Write Protection
Yes
Data Retention
40Year
Operating Supply Voltage (typ)
3.3/5V
Package Type
TSSOP
Operating Temp Range
-40C to 85C
Supply Current
2mA
Operating Supply Voltage (min)
2.5V
Operating Supply Voltage (max)
5.5V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-8622-2
M24256-BWDW6TP

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M24256-BWDW6TP
Manufacturer:
TI
Quantity:
12 400
Part Number:
M24256-BWDW6TP
Manufacturer:
ST
Quantity:
20 000
Part Number:
M24256-BWDW6TP@@@@@@
Manufacturer:
ST
0
M24256-BF, M24256-BR, M24256-BW, M24256-DR
Table 24.
14-Feb-2011
Date
Document revision history (continued)
Revision
23
Added caution under
side, with balls on the
Updated:
Moved:
Deleted:
– Table 25: Available M24256-BR, M24256-BW, M24256-BF products
– Table 26: Available M24256-DR products (package, voltage range,
Description
Section 3.5: Addressing the memory array
Section 3.17: Reading the Identification Page (M24256-D only)
Section 3.18: Reading the lock status (M24256-D only)
Table 2: Most significant address byte
Table 6: Absolute maximum ratings
Table 16: 400 kHz AC characteristics
Table 17: 1 MHz AC characteristics
Table 2: Most significant address byte
Table 3: Device select code to access the Identification page (M24256-
DR only)
(package, voltage range, temperature grade)
temperature grade)
Doc ID 6757 Rev 23
Figure 3: WLCSP connections (top view, marking
underside).
Changes
from
Section 2.6.4
Revision history
to
Section 3.5
41/42

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