MT48LC16M4A2P-75:G TR Micron Technology Inc, MT48LC16M4A2P-75:G TR Datasheet - Page 44

• Manufacturer Part Number: MT48LC16M4A2P-75:G TR
• Description: IC SDRAM 64MBIT 133MHZ 54TSOP
• Manufacturer: Micron Technology Inc

Specifications of MT48LC16M4A2P-75:G TR

• Format - Memory: RAM
• Memory Type: SDRAM
• Memory Size: 64M (16Mx4)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 54-TSOP II
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Electrical Specifications
Table 11:
Temperature and Thermal Impedance
PDF: 09005aef80725c0b/Source: 09005aef806fc13c
64MSDRAM_2.fm - Rev. N 12/08 EN
Parameter
Voltage on V
Voltage on inputs, NC or I/O pins relative to V
Operating temperature
T
T
T
Storage temperature (plastic)
Power dissipation
A
A
A
(commercial)
(industrial)
(automotive)
DD
Absolute Maximum Ratings
, V
DD
Q supply relative to V
Stresses greater than those listed in Table 11 may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at these or any
other conditions above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may
affect reliability.
It is imperative that the SDRAM device’s temperature specifications, shown in Figure 12
on page 45, be maintained to ensure the junction temperature is in the proper operating
range to meet data sheet specifications. An important step in maintaining the proper
junction temperature is using the device’s thermal impedances correctly. The thermal
impedances are listed in Table 13 on page 45 for the applicable die revision and pack-
ages being made available. These thermal impedance values vary according to the
density, package, and particular design used for each device.
Incorrectly using thermal impedances can produce significant errors. Read Micron tech-
nical note, TN-00-08, “Thermal Applications,” prior to using the thermal impedances
listed in Table 13. To ensure the compatibility of current and future designs, contact
Micron Applications Engineering to confirm thermal impedance values.
The SDRAM device’s safe junction temperature range can be maintained when the TC
specification is not exceeded. In applications where the device's ambient temperature is
too high, use of forced air and/or heat sinks may be required to satisfy the case tempera-
ture specifications.
SS
SS
44
Micron Technology, Inc., reserves the right to change products or specifications without notice.
64Mb: x4, x8, x16 SDRAM
Min
–1V
–1V
–40
–40
–55
Electrical Specifications
0
–
©2000 Micron Technology, Inc. All rights reserved.
Max
+105
+150
+4.6
+4.6
+85
70
1
Units
°C
°C
W
V
V