NCP380HSN10AGEVB ON Semiconductor, NCP380HSN10AGEVB Datasheet - Page 22

• Manufacturer Part Number: NCP380HSN10AGEVB
• Description: Power Management IC Development Tools NCP380 EVAL BOARD
• Manufacturer: ON Semiconductor
• Type: Power Driversr

Specifications of NCP380HSN10AGEVB

• Rohs: yes
• Product: Evaluation Boards
• Tool Is For Evaluation Of: NCP380
• Output Current: 10 A

2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
0.039
1.0
C A B
0.037
PACKAGE DIMENSIONS
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
J
CASE 483−02
K
ISSUE H
TSOP−5
0.074
DETAIL Z
1.9
22
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
inches
A
B
C
D
G
H
K
M
J
L
S
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_