NCP380HSN10AGEVB ON Semiconductor, NCP380HSN10AGEVB Datasheet - Page 23

• Manufacturer Part Number: NCP380HSN10AGEVB
• Description: Power Management IC Development Tools NCP380 EVAL BOARD
• Manufacturer: ON Semiconductor
• Type: Power Driversr

Specifications of NCP380HSN10AGEVB

• Rohs: yes
• Product: Evaluation Boards
• Tool Is For Evaluation Of: NCP380
• Output Current: 10 A

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0.05
NOTE 5
E1
A1
É É É
e
6
1
2
5
D
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
3
4
b
E
A
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
c
DETAIL Z
L
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
USA/Canada
Phone: [phone]
Phone: 81−3−5817−1050
DETAIL Z
H
3.20
M
http://onsemi.com
RECOMMENDED
CASE 318G−02
L2
C
GAUGE
PLANE
ISSUE V
TSOP−6
SEATING
PLANE
DIMENSIONS: MILLIMETERS
23
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
0.95
PITCH
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
0.60
6X
0.95
6X
DIM
A1
E1
L2
M
A
b
D
E
L
c
e
MIN
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
0
MILLIMETERS
0.25 BSC
NOM
1.00
0.06
0.38
0.18
3.00
2.75
1.50
0.95
0.40
−
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
1.10
0.10
0.50
0.26
3.10
3.00
1.70
1.05
0.60
10
NCP380/D