NCP380HSN10AGEVB ON Semiconductor, NCP380HSN10AGEVB Datasheet - Page 3

• Manufacturer Part Number: NCP380HSN10AGEVB
• Description: Power Management IC Development Tools NCP380 EVAL BOARD
• Manufacturer: ON Semiconductor
• Type: Power Driversr

Specifications of NCP380HSN10AGEVB

• Rohs: yes
• Product: Evaluation Boards
• Tool Is For Evaluation Of: NCP380
• Output Current: 10 A

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. According to JEDEC standard JESD22−A108.
2. This device series contains ESD protection and passes the following tests:
3. Except EN pin, 150 V.
4. Latch up Current Maximum Rating: 100 mA per JEDEC standard: JESD78 class II.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.
6. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
7. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
8. The R
9. The maximum power dissipation (P
Table 2. MAXIMUM RATINGS
Table 3. OPERATING CONDITIONS
From IN to OUT Pins: Input/Output (Note 1)
IN, OUT, EN, ILIM, FLAG, Pins: Input/Output (Note 1)
FLAG Sink Current
I
ESD Withstand Voltage (IEC 61000−4−2)
(Output Only, when Bypassed with 1.0 mF Capacitor Minimum)
Maximum Junction Temperature Range (Note 6)
Storage Temperature Range
Moisture Sensitivity (Note 5)
Symbol
Human Body Model (HBM) ESD Rating (Note 2)
Machine Model (MM) ESD Rating (Notes 2 and 3)
Latch-up Protection (Note 4)
LIM
C
Human Body Model (HBM) 2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) 200 V per JEDEC standard: JESD22−A115 for all pins.
R
with 2-once copper traces on top and bottom of the board. Exposed pad is connected to ground plane for UDFN−6 version only.
I
R
I
V
SINK
C
V
OUT
Pins IN, OUT, EN, ILIM, FLAG
P
T
T
OUT
ILIM
qJA
EN
IN
IN
A
D
J
Source Current
qJA
is dependent of the PCB heat dissipation. Board used to drive this data was a 2”  2” NCP380EVB board. It is a 2 layers board
Operational Power Supply
Enable Voltage
Ambient Temperature Range
Junction Temperature Range
Resistor from ILIM to GND Pin
FLAG Sink Current
Decoupling Input Capacitor
Decoupling Output Capacitor
Thermal Resistance Junction-to-Air
Maximum DC Current
Power Dissipation Rating (Note 9)
Parameter
Rating
D
) is given by the following formula:
T
T
http://onsemi.com
A
UDFN−6 Package (Notes 7 and 8)
TSOP−5 Package (Notes 7 and 8)
TSOP−6 Package (Notes 7 and 8)
A
v 25C
= 85C
TSOP−5, TSOP−6 Package
UDFN−6 Package
USB Port per Hub
3
Conditions
V
P
EN,
UDFN−6 Package
TSOP−5 Package
TSOP−6 Package
UDFN−6 Package
TSOP−5 Package
TSOP−6 Package
D
+
V
ILIM,
T
V
ESD HBM
JMAX
ESD IEC
ESD MM
Symbol
IN ,
V
T
I
R
MSL
SINK
I
FLAG,
LU
LIM
STG
T
qJA
V
J
* T
OUT
V
A
IN,
V
OUT
Min
−40
−40
120
2.5
5.0
1.0
0
−
−
−
−
−
−
−
−
−
−
−
−
15 Air, 8 Contact
−40 to +TSD
−7.0 to +7.0
−0.3 to +7.0
−40 to +150
Typ
120
305
280
325
350
325
130
145
830
25
25
−
−
−
−
−
−
−
−
Level 1
Value
2,000
200
100
1
1
+125
Max
+85
250
5.5
5.5
1.0
2.1
1.0
−
−
−
−
−
−
−
−
−
−
−
C/W
C/W
C/W
Unit
Unit
mW
mW
mW
mW
mW
mW
mA
mA
mA
mA
kW
kV
mF
mF
C
C
C
C
V
V
V
V
V
A
A