M24C64-WBN6P STMicroelectronics, M24C64-WBN6P Datasheet - Page 5

IC EEPROM 64KBIT 400KHZ 8DIP

M24C64-WBN6P

Manufacturer Part Number
M24C64-WBN6P
Description
IC EEPROM 64KBIT 400KHZ 8DIP
Manufacturer
STMicroelectronics
Datasheet

Specifications of M24C64-WBN6P

Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
64K (8K x 8)
Speed
400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Organization
8 K x 8
Interface Type
I2C
Maximum Clock Frequency
0.4 MHz
Access Time
900 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.5 V
Maximum Operating Current
2 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
2.5 V, 5.5 V
Memory Organization
8K X 8
Clock Speed
400MHz
No. Of Pins
8
Operating Temperature Range
-40°C To +85°C
Ic Generic Number
24C64
Memory Voltage, Vcc
2.5V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-8575
M24C64-WBN6P

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M24C64-WBN6P
Manufacturer:
SIMCOM
Quantity:
1 000
Part Number:
M24C64-WBN6P
Manufacturer:
ST
0
M24C64-DF, M24C64-W, M24C64-R, M24C64-F
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8-pin package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
WLCSP connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
I
capacitance (C
I
parasitic capacitance (C
I
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 17
Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
AC test measurement I/O waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 33
SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . 34
TSSOP8 – 8 lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 35
UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead
2 × 3mm, package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
WLCSP-R 5-bump wafer-length chip-scale package outline . . . . . . . . . . . . . . . . . . . . . . . 37
2
2
2
C Fast mode (f
C Fast mode Plus (f
C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
bus
C
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
= 400 kHz): maximum R
C
= 1 MHz): maximum R
bus
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Doc ID 16891 Rev 23
bus
bus
value versus bus parasitic
value versus bus
List of figures
5/44

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