W25Q32BVZPIG Winbond Electronics, W25Q32BVZPIG Datasheet - Page 4

• Manufacturer Part Number: W25Q32BVZPIG
• Description: IC SPI FLASH 32MBIT 8WSON
• Manufacturer: Winbond Electronics

Specifications of W25Q32BVZPIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 32M (4M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-WSON
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8.
9.
10.
11.
ELECTRICAL CHARACTERISTICS ............................................................................................... 63
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.11
PACKAGE SPECIFICATION .......................................................................................................... 70
9.1
9.2
9.3
9.4
9.5
9.6
ORDERING INFORMATION .......................................................................................................... 77
10.1
REVISION HISTORY ...................................................................................................................... 79
7.2.38
7.2.39
Absolute Maximum Ratings ................................................................................................ 63
Operating Ranges............................................................................................................... 63
Power-up Timing and Write Inhibit Threshold .................................................................... 64
DC Electrical Characteristics .............................................................................................. 65
AC Measurement Conditions .............................................................................................. 66
AC Electrical Characteristics .............................................................................................. 67
AC Electrical Characteristics (cont’d) ................................................................................. 68
Serial Output Timing ........................................................................................................... 69
Serial Input Timing .............................................................................................................. 69
/HOLD Timing ..................................................................................................................... 69
/WP Timing ......................................................................................................................... 69
8-Pin SOIC 208-mil (Package Code SS) ............................................................................ 70
8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 71
8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 72
8-Pad WSON 8x6mm (Package Code ZE) ........................................................................ 74
16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 75
24-Ball TFBGA 8x6-mm (Package Code TC) .................................................................... 76
Valid Part Numbers and Top Side Marking ........................................................................ 78
Program Security Registers (42h) ...................................................................................... 61
Read Security Registers (48h) ........................................................................................... 62
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W25Q32BV