MT48V4M32LFF5-8:G Micron Technology Inc, MT48V4M32LFF5-8:G Datasheet - Page 79

• Manufacturer Part Number: MT48V4M32LFF5-8:G
• Description: IC SDRAM 128MBIT 125MHZ 90VFBGA
• Manufacturer: Micron Technology Inc

Specifications of MT48V4M32LFF5-8:G

• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 128M (4Mx32)
• Speed: 125MHz
• Interface: Parallel
• Voltage - Supply: 2.3 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 90-VFBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Figure 58:
PDF: 09005aef807f4885/Source: 09005aef8071a76b
128Mbx16x32Mobile_2.fm - Rev. M 1/09 EN
SEATING PLANE
DIMENSIONS APPLY
TO SOLDER BALLS POST
REFLOW. THE PRE-
REFLOW DIAMETER IS
0.42 ON A 0.40 SMD
BALL PAD
11.20 ±0.10
90X Ø0.45
0.10 A
90-Ball FBGA, “F5/B5” Package (x32 Device), 8mm x 13mm
BALL A9
5.60 ±0.05
Notes:
A
0.65 ±0.05
1. All dimensions are in millimeters.
2. Recommended pad size for PCB is 0.4mm ±0.025mm.
3. Package width and length do not include mold protrusion; allowable mold protrusion is
4. Topside part marking decoder can be found at
0.25mm per side.
3.20
8.00 ±0.10
6.40
C L
4.00 ±0.05
C L
6.50 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
79
13.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
128Mb: x16, x32 Mobile SDRAM
www.micron.com/decoder.
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
Package Dimensions
©2001 Micron Technology, Inc. All rights reserved.
BALL A1 ID