LNK614PG Power Integrations, LNK614PG Datasheet - Page 15

• Manufacturer Part Number: LNK614PG
• Description: IC OFFLINE SWIT OTP CV/CC 8DIP
• Manufacturer: Power Integrations
• Series: LinkSwitch®-IIr
• Type: Off Line Switcherr

Specifications of LNK614PG

• Mfg Application Notes: LinkSwitch-II Family, Appl Note AN-44
• Output Isolation: Isolated
• Frequency Range: 58 ~ 72kHz
• Voltage - Output: 700V
• Power (watts): 4.1W
• Operating Temperature: -40°C ~ 150°C
• Package / Case: 8-DIP (0.300", 7.62mm), 7 Leads
• Output Voltage: 700 V
• Input / Supply Voltage (max): 9 V
• Input / Supply Voltage (min): - 0.3 V
• Duty Cycle (max): 55 %
• Switching Frequency: 65 KHz
• Supply Current: 440 uA
• Operating Temperature Range: - 40 C to + 150 C
• Mounting Style: Through Hole
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 40 C
• Output Current: 400 mA
• Output Power: 4.1 W
• For Use With: 596-1235 - KIT REF DESIGN LINKSWITCH 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 596-1225-5

www.powerint.com
.240 (6.10)
.260 (6.60)
.125 (3.18)
.145 (3.68)
-T-
.100 (2.54) BSC
.032 (.81)
.037 (.94)
Pin 1
-D-
-E-
.125 (3.18)
.145 (3.68)
.240 (6.10)
.260 (6.60)
SEATING
PLANE
-E-
Pin 1
-D-
.014 (.36)
.022 (.56)
⊕
.367 (9.32)
.387 (9.83)
D S .004 (.10)
⊕
.100 (2.54) (BSC)
D S .004 (.10)
.367 (9.32)
.387 (9.83)
.048 (1.22)
.053 (1.35)
.048 (1.22)
.053 (1.35)
⊕
T E D S .010 (.25) M
.137 (3.48)
.009 (.23)
MINIMUM
⊕
SMD-8C (G Package)
E S
.057 (1.45)
.068 (1.73)
.057 (1.45)
.068 (1.73)
.372 (9.45)
.388 (9.86)
.120 (3.05)
.140 (3.56)
.137 (3.48)
DIP-8C (P Package)
(NOTE 5)
MINIMUM
MINIMUM
(NOTE 6)
.015 (.38)
.010 (.25)
.004 (.10)
.012 (.30)
Pin 1
Notes:
1. Package dimensions conform to JEDEC specification
2. Controlling dimensions are inches. Millimeter sizes are
3. Dimensions shown do not include mold flash or other
4. Pin locations start with Pin 1, and continue counter-clock-
5. Minimum metal to metal spacing at the package body for
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
Solder Pad Dimensions
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
shown in parentheses.
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 3 is omitted.
the omitted lead location is .137 inch (3.48 mm).
perpendicular to plane T.
.046 .060
.086
.004 (.10)
.008 (.20)
.015 (.38)
.186
.286
.300 (7.62) BSC
.036 (0.91)
.044 (1.12)
.300 (7.62)
.390 (9.91)
(NOTE 7)
.060 .046
.080
.420
LNK603-606/613-616
0 -
°
8
Notes:
1. Controlling dimensions are
2. Dimensions shown do not
3. Pin locations start with Pin 1,
4. Minimum metal to metal
5. Lead width measured at
6. D and E are referenced
°
inches. Millimeter sizes are
shown in parentheses.
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
and continue counter-clock-
wise to Pin 8 when viewed
from the top. Pin 3 is omitted.
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).
package body.
datums on the package
body.
PI-3933-101507
PI-4015-101507
G08C
P08C
Rev. F 01/10
15