LTC4211IS8 Linear Technology, LTC4211IS8 Datasheet - Page 33

• Manufacturer Part Number: LTC4211IS8
• Description: IC CTRLR HOTSWAP CURR CTRL 8SOIC
• Manufacturer: Linear Technology
• Type: Hot-Swap Controllerr

Specifications of LTC4211IS8

• Applications: General Purpose
• Internal Switch(s): No
• Voltage - Supply: 2.5 V ~ 16.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

APPLICATIO S I FOR ATIO
ramped up to its nominal operating value. After Time
Point 5, a supply voltage fault occurs at the load and the
Zener diode begins to conduct, causing V
crease. At Time Point 6A, V
the circuit breaker is tripped, the GATE pin voltage is pulled
to ground and FAULT is asserted low and latched.
In either case, the LTC4211 can be configured to auto-
matically initiate a start-up sequence. Please refer to the
section on AutoRetry After a Fault for additional
information.
PCB Layout Considerations
For proper operation of the LTC4211’s circuit breaker
function, a 4-wire Kelvin connection to the sense resistors
is highly recommended. A recommended PCB layout for
the sense resistor, the power MOSFET and the GATE drive
components around the LTC4211 is illustrated in
Figure 22. In Hot Swap applications where load currents
U
U
FILTER
is greater than 1.236V,
W
FILTER
U
to in-
can reach 10A or more, narrow PCB tracks exhibit more
resistance than wider tracks and operate at more elevated
temperatures. Since the sheet resistance of 1 ounce cop-
per foil is approximately 0.54mΩ/square, track resis-
tances add up quickly in high current applications. Thus,
to keep PCB track resistance and temperature rise to a
minimum, PCB track width must be appropriately sized.
Consult Appendix A of LTC Application Note 69 for details
on sizing and calculating trace resistances as a function of
copper thickness.
In the majority of applications, it will be necessary to use
plated-through vias to make circuit connections from
component layers to power and ground layers internal to
the PC board. For 1 ounce copper foil plating, a good
starting point is 1A of DC current per via, making sure the
via is properly dimensioned so that solder completely fills
any void. For other plating thicknesses, check with your
PCB fabrication facility.
LTC4211
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4211fa