IRS2336SPBF International Rectifier, IRS2336SPBF Datasheet - Page 29

• Manufacturer Part Number: IRS2336SPBF
• Description: IC DRIVER BRIDGE 3-PHASE 28-SOIC
• Manufacturer: International Rectifier

Specifications of IRS2336SPBF

• Configuration: 3 Phase Bridge
• Input Type: Differential
• Delay Time: 530ns
• Current - Peak: 200mA
• Number Of Configurations: 1
• Number Of Outputs: 3
• High Side Voltage - Max (bootstrap): 600V
• Voltage - Supply: 10 V ~ 20 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

IRS2336x(D) Family
Figure 22: Internal bootstrap MOSFET connection
Figure 23: Bootstrap MOSFET state diagram
A bootstrap MOSFET is suitable for most of the PWM modulation schemes and can be used either in parallel with the
external bootstrap network (i.e., diode and resistor) or as a replacement of it. The use of the integrated bootstrap as
a replacement of the external bootstrap network may have some limitations. An example of this limitation may arise
when this functionality is used in non-complementary PWM schemes (typically 6-step modulations) and at very high
PWM duty cycle. In these cases, superior performances can be achieved by using an external bootstrap diode in
parallel with the internal bootstrap network.
Bootstrap Power Supply Design
For information related to the design of the bootstrap power supply while using the integrated bootstrap functionality
of the IRS2336xD family, please refer to Application Note 1123 (AN-1123) entitled “Bootstrap Network Analysis:
Focusing on the Integrated Bootstrap Functionality.” This application note is available at www.irf.com.
For information related to the design of a standard bootstrap power supply (i.e., using an external discrete diode)
please refer to Design Tip 04-4 (DT04-4) entitled “Using Monolithic High Voltage Gate Drivers.” This design tip is
available at www.irf.com.
Separate Logic and Power Grounds
The IRS2336xD has separate logic and power ground pin (V
and COM respectively) to eliminate some of the noise
SS
problems that can occur in power conversion applications. Current sensing shunts are commonly used in many
applications for power inverter protection (i.e., over-current protection), and in the case of motor drive applications, for
motor current measurements. In these situations, it is often beneficial to separate the logic and power grounds.
Figure 24 shows a HVIC with separate V
and COM pins and how these two grounds are used in the system. The
SS
V
is used as the reference point for the logic and over-current circuitry; V
in the figure is the voltage between the
SS
X
ITRIP pin and the V
pin. Alternatively, the COM pin is the reference point for the low-side gate drive circuitry. The
SS
output voltage used to drive the low-side gate is V
-COM; the gate-emitter voltage (V
) of the low-side switch is the
LO
GE
output voltage of the driver minus the drop across R
.
G,LO
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© 2009 International Rectifier
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