MC33882DH Freescale Semiconductor, MC33882DH Datasheet - Page 8

• Manufacturer Part Number: MC33882DH
• Description: IC SWITCH 6X LOW-SIDE 30-HSOP
• Manufacturer: Freescale Semiconductor
• Type: Low Sider

Specifications of MC33882DH

• Input Type: SPI
• Number Of Outputs: 6
• On-state Resistance: 400 mOhm
• Current - Peak Output: 6A
• Voltage - Supply: 8 V ~ 25 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 30-HSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output / Channel: -

Table 3. Maximum Ratings (continued)
8
33882
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
THERMAL RESISTANCE
Notes
Junction-to-Ambient, Natural Convection, Single-Layer Board (1s)
Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p)
Junction-to-Board (Bottom)
Junction-to-Case (Top)
11.
12.
13.
14.
15.
All voltages are with respect to ground unless otherwise noted.
HSOP
QFN
HSOP
QFN
HSOP
QFN
HSOP
QFN
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC
883, Method 1012.1) with the cold plate temperature used for the case temperature.
(15)
(11)
,
(12)
Rating
(13)
(14)
Symbol
R
R
R
R
θ
θ
θ
θ
JMA
JB
JC
JA
Analog Integrated Circuit Device Data
Value
3.0
0.2
1.2
41
85
18
27
10
Freescale Semiconductor
Limit
°C/W
°C/W
°C/W
°C/W