IR3084UMTRPBF International Rectifier, IR3084UMTRPBF Datasheet - Page 44

• Manufacturer Part Number: IR3084UMTRPBF
• Description: IC CTLR XPHASE 28-MLPQ
• Manufacturer: International Rectifier
• Series: XPhase™r

Specifications of IR3084UMTRPBF

• Package / Case: 28-MLPQ
• Mounting Type: Surface Mount
• Current - Supply: 14mA
• Voltage - Supply: 9.5 V ~ 16 V
• Operating Temperature: 0°C ~ 100°C
• Applications: Processor
• Package: 28-Lead MLPQ
• Circuit: X-Phase Control IC
• Switch Freq (khz): 150kHz to 1.0MHz
• Pbf: PbF Option Available
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

METAL AND SOLDER RESIST
• The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The
• The minimum solder resist width is 0.13mm, therefore it is recommended that the solder resist is
• At the inside corner of the solder resist where the lead land groups meet, it is recommended to
• The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto
• Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high
• The single via in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm larger
solder resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all
Non Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD
pads.
completely removed from between the lead lands forming a single opening for each “group” of lead
lands.
provide a fillet so a solder resist width of ≥ 0.17mm remains.
the copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is
allowable to have the solder resist opening for the land pad to be smaller than the part pad.
aspect ratio of the solder resist strip separating the lead lands from the pad land.
than the diameter of the via.
Page 44 of 47
IR3084U
9/14/2005