MT8VDDT1664HG-26AB2 Micron Technology Inc, MT8VDDT1664HG-26AB2 Datasheet - Page 9

• Manufacturer Part Number: MT8VDDT1664HG-26AB2
• Description: MODULE SDRAM DDR 128MB 200SODIMM
• Manufacturer: Micron Technology Inc

Specifications of MT8VDDT1664HG-26AB2

• Memory Type: DDR SDRAM
• Memory Size: 128MB
• Speed: 266MT/s
• Package / Case: 200-SODIMM
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Table 6:
NOTE:
Table 7:
pdf: 09005aef8092973f, source: 09005aef80921669
DD8C16_32_64x64HG.fm - Rev. B 9/04 EN
LENGTH
1. For a burst length of two, A1
2. For a burst length of four, A2
3. For a burst length of eight, A3
4. Whenever a boundary of the block is reached within a
5. i = 9 (128MB, 256MB)
BURST
element block; A0 selects the first access within the
block.
element block; A0
block.
element block; A0
block.
given sequence above, the following access wraps
within the block.
i = 9, 11 (512MB)
2
4
8
SPEED
-26A
-335
-262
-265
A2 A1 A0
0
0
0
0
1
1
1
1
STARTING
ADDRESS
COLUMN
Burst Definition Table
CAS Latency (CL) Table
A1 A0
0
0
1
1
0
0
1
1
0
0
1
1
A0
–
–
75
75
75
75
0
1
0
1
0
1
0
1
0
1
0
1
0
1
A1 select the first access within the
A2 select the first access within the
CLOCK FREQUENCY (MHZ)
CL = 2
ALLOWABLE OPERATING
0-1-2-3-4-5-6-7 0-1-2-3-4-5-6-7
1-2-3-4-5-6-7-0 1-0-3-2-5-4-7-6
2-3-4-5-6-7-0-1 2-3-0-1-6-7-4-5
3-4-5-6-7-0-1-2 3-2-1-0-7-6-5-4
4-5-6-7-0-1-2-3 4-5-6-7-0-1-2-3
5-6-7-0-1-2-3-4 5-4-7-6-1-0-3-2
6-7-0-1-2-3-4-5 6-7-4-5-2-3-0-1
7-0-1-2-3-4-5-6 7-6-5-4-3-2-1-0
f
f
f
f
SEQUENTIAL
133
133
133
100
TYPE =
0-1-2-3
1-2-3-0
2-3-0-1
3-0-1-2
ORDER OF ACCESSES
0-1
1-0
–
–
WITHIN A BURST
–
Ai select the two-data-
Ai select the four-data-
Ai select the eight-data-
75
75
75
75
INTERLEAVED
CL = 2.5
TYPE =
0-1-2-3
1-0-3-2
2-3-0-1
3-2-1-0
f
f
f 133
f 133
0-1
1-0
166
133
9
Operating Mode
MODE REGISTER SET command with bits A7–A11
(128MB), or A7–A12 (256MB, 512MB) each set to zero,
and bits A0–A6 set to the desired values. A DLL reset is
initiated by issuing a MODE REGISTER SET command
with bits A7 and A9–A11 (128MB), or A7 and A9–A12
(256MB, 512MB) each set to zero, bit A8 set to one, and
bits A0–A6 set to the desired values. Although not
required by the Micron device, JEDEC specifications
recommend when a LOAD MODE REGISTER com-
mand is issued to reset the DLL, it should always be
followed by a LOAD MODE REGISTER command to
select normal operating mode.
(128MB), or A7–A12 (256MB, 512MB) are reserved for
future use and/or test modes.
reserved states should not be used because unknown
operation or incompatibility with future versions may
result.
Extended Mode Register
beyond those controlled by the mode register; these
additional functions are DLL enable/disable and out-
put drive strength. These functions are controlled via
the bits shown in Figure 6, Extended Mode Register
Definition Diagram, on page 10. The extended mode
COMMAND
COMMAND
128MB, 256MB, 512MB (x64, SR)
The normal operating mode is selected by issuing a
All other combinations of values for A7–A11
The extended mode register controls functions
DQS
DQS
CK#
CK#
DQ
DQ
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Figure 5: CAS Latency Diagram
CK
CK
READ
READ
Burst Length = 4 in the cases shown
Shown with nominal t AC, t DQSCK, and t DQSQ
T0
T0
200-PIN DDR SODIMM
TRANSITIONING DATA
CL = 2
CL = 2.5
NOP
NOP
T1
T1
©2004 Micron Technology, Inc. All rights reserved.
T2
NOP
NOP
T2
Test modes and
T2n
T2n
DON’T CARE
T3
NOP
NOP
T3
T3n
T3n