MT18HTF25672FDY-80EE1D4 Micron Technology Inc, MT18HTF25672FDY-80EE1D4 Datasheet

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MT18HTF25672FDY-80EE1D4

Manufacturer Part Number
MT18HTF25672FDY-80EE1D4
Description
MODULE DDR2 2GB 240-FBDIMM
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT18HTF25672FDY-80EE1D4

Memory Type
DDR2 SDRAM
Memory Size
2GB
Speed
800MT/s
Package / Case
240-FBDIMM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
DDR2 SDRAM FBDIMM
MT18HTF12872FD – 1GB
MT18HTF25672FD – 2GB
Features
• 240-pin, DDR2 fully buffered dual in-line memory
• Fast data transfer rates: PC2-4200, PC2-5300, or
• 1GB (128 Meg x 72), 2GB (256 Meg x 72)
• 3.2 Gb/s, 4 Gb/s, or 4.8 Gb/s link transfer rates
• High-speed, 1.5V differential, point-to-point link be-
• Fault-tolerant; can work around a bad bit lane in
• High-density scaling with up to eight FBDIMM devi-
• SMBus interface to AMB for configuration register
• In-band and out-of-band command access
• Deterministic protocol
• Automatic DDR2 SDRAM bus and channel calibra-
• Transmitter de-emphasis to reduce ISI
• MBIST and IBIST test functions
• Transparent mode for DRAM test support
• V
• V
• V
• V
• Serial presence-detect (SPD) with EEPROM
• Gold edge contacts
• Dual rank
• Supports 95°C operation with 2X refresh
PDF: 09005aef81a2f237
htf18c128_256x72fdy.pdf - Rev. D 12/09 EN
module (FBDIMM)
PC2-6400
tween the host controller and advanced memory
buffer (AMB)
each direction
cess per channel
access
– Enables memory controller to optimize DRAM ac-
– Delivers precise control and repeatable memory
tion
DD
REF
CC
DDSPD
cesses for maximum performance
behavior
= 1.5V for AMB
= V
= 0.9V SDRAM command/address termination
DDQ
= 3–3.6V for AMB and EEPROM
= 1.8V for DRAM
Products and specifications discussed herein are subject to change by Micron without notice.
1GB, 2GB (x72, DR) 240-Pin DDR2 SDRAM FBDIMM
1
Figure 1: 240-Pin FBDIMM (MO-256 R/C B)
Module height: 30.35mm (1.19in)
Options
• Package
• Frequency/CAS latency
– 240-pin DIMM (Pb-free)
– 2.5ns @ CL = 5 (DDR2-800)
– 3.0ns @ CL = 5 (DDR2-667)
– 3.75ns @ CL = 4 (DDR2-533)
Note:
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1. Not recommended for new designs.
© 2005 Micron Technology, Inc. All rights reserved.
1
Marking
Features
-80E
-667
-53E
Y

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MT18HTF25672FDY-80EE1D4 Summary of contents

Page 1

DDR2 SDRAM FBDIMM MT18HTF12872FD – 1GB MT18HTF25672FD – 2GB Features • 240-pin, DDR2 fully buffered dual in-line memory module (FBDIMM) • Fast data transfer rates: PC2-4200, PC2-5300, or PC2-6400 • 1GB (128 Meg x 72), 2GB (256 Meg x 72) ...

Page 2

... Data sheets for the base devices can be found on Micron’s Web page. Notes: 2. All part numbers end with a four-place code (not shown) that designates component, PCB, and AMB revi- sions. Consult factory for current revision codes. Example: MT18HTF25672FDY-667E1D4. PDF: 09005aef81a2f237 htf18c128_256x72fdy.pdf - Rev. D 12/09 EN ...

Page 3

Pin Assignments and Descriptions Table 5: Pin Assignments 240-Pin FBDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol PN3 PN3 ...

Page 4

Table 6: Pin Descriptions Symbol Type Description PS[9:0] Input Primary southbound data, positive lines. PS#[9:0] Input Primary southbound data, negative lines. SCK Input System clock input, positive line. SCK# Input System clock Input, negative line. SCL Input Serial presence-detect (SPD) ...

Page 5

... System Block Diagram Commodity DDR2 DDR2 SDRAM component devices DDR2 component DDR2 component DDR2 component modules AMB • • • DDR2 component DDR2 component DDR2 component DDR2 component SMBus access to buffer registers Micron Technology, Inc. reserves the right to change products or specifications without notice. ...

Page 6

Functional Block Diagram Figure 3: Functional Block Diagram CS1# CS0# DQS0 DQS0# DM0 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQS1 DQS1# DM5 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQS2 DQS2# DM2 DQ16 DQ17 DQ18 DQ19 DQ20 ...

Page 7

General Description Micron’s FBDIMM devices adhere to the currently proposed industry specifications for FBDIMMs. The following specifications contain detailed information on FBDIMM de- sign, interfaces, and theory of operation and are listed here for the system designers’ convenience. Refer to ...

Page 8

Table 7: I Conditions (Continued) DD Symbol Condition I Training: Primary and secondary channels enabled; 100% toggle on all channel lanes; DD_TRAINING DRAMs idle; 0% bandwidth; CKE HIGH; Command and address lines stable; DDR2 SDRAM clock active I IBIST over ...

Page 9

Table 12: I Specifications – 2GB DDR2-667 DD Symbol I DD_IDLE_0 I 2600 CC I 1420 DD Total power 6.8 Table 13: I Specifications – 12B DDR2-800 DD Symbol I DD_IDLE_0 I TBD CC I TBD DD Total power TBD ...

Page 10

Table 15: Serial Presence-Detect EEPROM AC Operating Conditions (Continued) Parameter/Condition SDA and SCL rise time SCL clock frequency Data-in setup time Start condition setup time Stop condition setup time WRITE cycle time 1. To avoid spurious start and stop conditions, ...

Page 11

Module Dimensions Figure 4: 240-Pin DDR2 FBDIMM 66.68 (2.63) TYP 0.5 (0.02) R (4X) 1.5 (0.059 (4X) 2.6 (0.102) D (2X) 5.2 (0.205) TYP 1.25 (0.0492) Pin 1 TYP 1.0 (0.039) TYP 74.68 (2.94) 9.9 (0.39) TYP ...

Page 12

S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 www.micron.com/productsupport Customer Comment Line: 800-932-4992 Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. This data ...

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