QW020A0G1-H Lineage Power, QW020A0G1-H Datasheet - Page 18

• Manufacturer Part Number: QW020A0G1-H
• Description: CONVERTER DC/DC 2.5V 50W OUT T/H
• Manufacturer: Lineage Power
• Series: QWr
• Type: Isolated with Remote On/Offr

Specifications of QW020A0G1-H

• Output: 2.5V
• Number Of Outputs: 1
• Power (watts): 50W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: 8-DIP Module
• 1st Output: 2.5 VDC @ 20A
• Size / Dimension: 2.28" L x 1.45" W x 0.34" H (57.9mm x 36.8mm x 8.6mm)
• Power (watts) - Rated: 50W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 89%
• Approvals: CE, CSA, UL, VDE
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -

Data Sheet
August 22, 2006
Through-Hole Lead-Free Soldering Infor-
mation
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant components.
They are designed to be processed through single or dual
wave soldering machines. The pins have an RoHS-compli-
ant finish that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of 3°C/s is
suggested. The wave preheat process should be such that
the temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot temperature is
260°C, while the Pb-free solder pot is 270°C max. Not all
RoHS-compliant through-hole products can be processed
with paste-through-hole Pb or Pb-free reflow process. If addi-
tional information is needed, please consult with your Tyco
Electronics Power System representative for more details.
Surface Mount Information
Pick and Place Area
Although the module weight is minimized by using open-
frame construction, the modules have a relatively large mass
compared to conventional surface-mount components. To
optimize the pick-and-place process, automated vacuum
equipment variables such as nozzle size, tip style, vacuum
pressure, and placement speed should be considered. Sur-
face-mount versions of this family have a flat surface which
serves as a pick-and-place location for automated vacuum
equipment. The module’s pick-and-place location is identified
in Figure 56.
Figure 50. Pick and Place Location.
Reflow Soldering Information
The QW series of power modules is available for either
Through-Hole (TH) or Surface Mount (SMT) soldering.
These power modules are large mass, low thermal resistance
devices and typically heat up slower than other SMT compo-
nents. It is recommended that the customer review data
Tyco Electronics Power Systems
18.288
(0.72)
25.654
(1.01)
36 Vdc to 75 Vdc Input; 1.2 Vdc to 5.0 Vdc Output; 10 A to 20 A
Product Label
Pick and Place Target
Symbol on Label
QW010/015/020 Series Power Modules: dc-dc Converters;
sheets in order to customize the solder reflow profile for each
application board assembly.
The following instructions must be observed when SMT sol-
dering these units. Failure to observe these instructions may
result in the failure of or cause damage to the modules, and
can adversely affect long-term reliability.
Typically, the eutectic solder melts at 183
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the connection to
ensure a reliable solder joint. There are several types of
SMT reflow technologies currently used in the industry.
These surface mount power modules can be reliably sol-
dered using natural forced convection, IR (radiant infrared),
or a combination of convection/IR.
Figure 51. Recommended Reflow profile.
Figure 52. Time Limit curve above 205
Lead Free Soldering
The -Z version SMT modules of the QW series are lead-free
(Pb-free) and RoHS compliant and are compatible in a Pb-
free soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to the
modules and can adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Moisture/
Reflow Sensitivity Classification for Nonhermetic Solid State
Surface Mount Devices) for both Pb-free solder profiles and
MSL classification procedures. This standard provides a rec-
ommended forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The sug-
gested Pb-free solder paste is Sn/Ag/Cu (SAC). The recom-
mended linear reflow profile using Sn/Ag/Cu solder is shown
in Figure. 59.
300
200
250
100
150
240
235
230
225
220
205
200
215
210
50
0
0
10
Heat zone
max 4
Preheat zone
max 4
Peak Temp 235
20
REFLOW TIME (S)
o
Cs
o
Soak zone
30-240s
Cs
TIME (S)
-1
-1
30
o
C
40
T
205
lim
o
o
C, wets the land,
above
0
C
C.
50
Cooling
zone
1-4
o
Cs
-1
60
18