QW020A0G1-H Lineage Power, QW020A0G1-H Datasheet - Page 19

• Manufacturer Part Number: QW020A0G1-H
• Description: CONVERTER DC/DC 2.5V 50W OUT T/H
• Manufacturer: Lineage Power
• Series: QWr
• Type: Isolated with Remote On/Offr

Specifications of QW020A0G1-H

• Output: 2.5V
• Number Of Outputs: 1
• Power (watts): 50W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: 8-DIP Module
• 1st Output: 2.5 VDC @ 20A
• Size / Dimension: 2.28" L x 1.45" W x 0.34" H (57.9mm x 36.8mm x 8.6mm)
• Power (watts) - Rated: 50W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 89%
• Approvals: CE, CSA, UL, VDE
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -

Data Sheet
August 22, 2006
Tyco Electronics Power Systems
Surface Mount Information
MSL Rating
The QW series SMT modules have a MSL rating of 2.
Storage and Handling
The recommended storage environment and handling proce-
dures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These sealed pack-
ages should not be broken until time of use. Once the origi-
nal package is broken, the floor life of the product at
conditions of £ 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The shelf life
for dry packed SMT packages will be a minimum of 12
months from the bag seal date, when stored at the following
conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to Tyco
Electronics Board Mounted Power Modules: Soldering and
Cleaning Application Note (AP01-056EPS).
Figure 53. Recommended linear reflow profile using Sn/
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet
the solder ball requirements per J-STD-001B. These require-
ments state that solder balls must neither be loose nor violate
the power module minimum electrical spacing.
The cleanliness designator of the open frame power module
is C00 (per J specification).
300
250
200
150
100
50
0
Per J-STD-020 Rev. C
Heating Zone
1°C/Second
Ag/Cu solder.
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
36 Vdc to 75 Vdc Input; 1.2 Vdc to 5.0 Vdc Output; 10 A to 20 A
(continued)
QW010/015/020 Series Power Modules: dc-dc Converters;
Cooling
Zone
19