ADZS-21262-1-EZEXT Analog Devices Inc, ADZS-21262-1-EZEXT Datasheet - Page 52

• Manufacturer Part Number: ADZS-21262-1-EZEXT
• Description: BOARD DAUGHTER FOR ADSP-21262
• Manufacturer: Analog Devices Inc

Specifications of ADZS-21262-1-EZEXT

• Accessory Type: DSP
• Silicon Manufacturer: Analog Devices
• Core Architecture: SHARC
• Features: Expansion Interface, High Speed Converter (HSC) Interface
• Kit Contents: Board Docs
• Silicon Family Name: SHARC
• Silicon Core Number: ADSP-21262
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: ADSP-21262
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
SURFACE-MOUNT DESIGN
Table 47
dard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Table 47. BGA Data for Use with Surface-Mount Design
Package
136-Ball CSP_BGA (BC-136)
is provided as an aid to PCB design. For industry stan-
1.70 MAX
Figure 48. 136-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Package Ball Attach Type
Solder Mask Defined
DETAIL A
BALL A1
INDICATOR
TOP VIEW
12.10
12.00 SQ
11.90
* COMPLIANT WITH JEDEC STANDARDS MO-205-AE
WITH EXCEPTION TO BALL DIAMETER.
Rev. G | Page 52 of 56 | March 2011
Dimensions shown in millimeters
0.25 MIN
(BC-136)
BSC SQ
10.40
BALL DIAMETER
* 0.50
14
0.45
0.40
Package Solder Mask
Opening
0.40 mm diameter
13
12
DETAIL A
11
BOTTOM VIEW
0.80 BSC
10
9
8
7
INDEX AREA
6
A1 CORNER
5
SEATING
PLANE
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
1.31
1.21
1.10
0.12 MAX
COPLANARITY
Package Ball Pad Size
0.53 mm diameter