DAC121C08XEB/NOPB National Semiconductor, DAC121C08XEB/NOPB Datasheet - Page 3

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DAC121C08XEB/NOPB

Manufacturer Part Number
DAC121C08XEB/NOPB
Description
BOARD EVAL FOR DAC121C081/5
Manufacturer
National Semiconductor
Series
PowerWise®r

Specifications of DAC121C08XEB/NOPB

Number Of Dac's
1
Number Of Bits
12
Outputs And Type
1, Single Ended
Data Interface
Serial
Settling Time
6µs
Dac Type
Voltage
Voltage Supply Source
Single
Operating Temperature
-40°C ~ 125°C
Utilized Ic / Part
DAC121C081/5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DAC121C08XEB
(LLP only)
Pin Descriptions
Package Pinouts
Symbol
MSOP-8
ADR0
ADR1
TSOT
V
GND
SDA
V
PAD
SCL
LLP
V
OUT
REF
A
Analog Output
Input/Output
Digital Input,
Digital Input,
Digital Input
V
three levels
three levels
OUT
1
6
8
Ground
Ground
Supply
Supply
Digital
Type
V
2
5
6
A
GND
3
4
5
Equivalent Circuit
SDA
4
3
4
3
SCL
5
2
3
Analog Output Voltage.
Power supply input. For the TSOT and LLP versions, this
supply is used as the reference. Must be decoupled to
GND.
Ground for all on-chip circuitry.
Serial Data bi-directional connection. Data is clocked into
or out of the internal 16-bit register relative to the clock
edges of SCL. This is an open drain data line that must be
pulled to the supply (V
Serial Clock Input. SCL is used together with SDA to
control the transfer of data in and out of the device.
Tri-state Address Selection Input. Sets the two Least
Significant Bits (A1 & A0) of the 7-bit slave address. (see
Table 1)
Tri-state Address Selection Input. Sets Bits A6 & A3 of the
7-bit slave address. (see Table 1)
Unbufferred reference voltage. For the MSOP-8, this
supply is used as the reference. V
and decoupled to GND.
Exposed die attach pad can be connected to ground or left
floating. Soldering the pad to the PCB offers optimal
thermal performance and enhances package self-
alignment during reflow.
ADR0
6
1
1
ADR1
N/A
N/A
2
Description
A
) by an external pull-up resistor.
V
N/A
N/A
REF
7
REF
must be free of noise
PAD (LLP only)
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N/A
N/A
7

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