DAC121C08XEB/NOPB National Semiconductor, DAC121C08XEB/NOPB Datasheet - Page 8

• Manufacturer Part Number: DAC121C08XEB/NOPB
• Description: BOARD EVAL FOR DAC121C081/5
• Manufacturer: National Semiconductor
• Series: PowerWise®r

Specifications of DAC121C08XEB/NOPB

• Number Of Dac's: 1
• Number Of Bits: 12
• Outputs And Type: 1, Single Ended
• Data Interface: Serial
• Settling Time: 6µs
• Dac Type: Voltage
• Voltage Supply Source: Single
• Operating Temperature: -40°C ~ 125°C
• Utilized Ic / Part: DAC121C081/5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: DAC121C08XEB

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t
t
t
t
t
C
t
t
rDA
fDA
rCL
rCL1
fCL
SP
outz
Symbol
b
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions. Operation of the device beyond the maximum Operating Ratings is not recommended.
Note 2: All voltages are measured with respect to GND = 0V, unless otherwise specified.
Note 3: When the input voltage at any pin exceeds 5.5V or is less than GND, the current at that pin should be limited to 10 mA. The 20 mA maximum package
input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two.
Note 4: The absolute maximum junction temperature (T
junction-to-ambient thermal resistance (θ
for maximum power dissipation will be reached only when the device is operated in a severe fault condition (e.g., when input or output pins are driven beyond
the operating ratings, or the power supply polarity is reversed).
Note 5: Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is a 220 pF capacitor discharged through 0 Ω. Charge
device model simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged.
Rise time of SDA signal
Fall time of SDA signal
Rise time of SCL signal
Rise time of SCL signal after a
repeated start condition and after an
acknowledge bit.
Fall time of a SCL signal
Capacitive load for each bus line (SCL
and SDA)
Pulse Width of spike suppressed
(Notes 11, 10)
SDA output delay (see Section 1.9)
Parameter
JA
), and the ambient temperature (T
J
max) for this device is 150°C. The maximum allowable power dissipation is dictated by T
Standard Mode
Fast Mode
High Speed Mode, C
High Speed Mode, C
Standard Mode
Fast Mode
High Speed Mode, C
High Speed Mode, C
Standard Mode
Fast Mode
High Speed Mode, C
High Speed Mode, C
Standard Mode
Fast Mode
High Speed Mode, C
High Speed Mode, C
Standard Mode
Fast Mode
High Speed Mode, C
High Speed Mode, C
Fast Mode
High Speed Mode
Fast Mode
High Speed Mode
Conditions (Note 13)
A
), and can be calculated using the formula P
8
b
b
b
b
b
b
b
b
b
b
= 100pF
= 400pF
= 100pF
= 400pF
= 100pF
= 400pF
= 100pF
= 400pF
= 100pF
= 400pF
(Note 9)
Typical
87
38
D
MAX = (T
20+0.1C
20+0.1C
20+0.1C
20+0.1C
20+0.1C
(Notes 9,
Limits
1000
1000
1000
J
300
160
250
250
160
300
300
160
300
300
400
270
max − T
13)
10
80
20
10
80
20
10
40
20
80
10
80
20
10
40
20
80
50
10
60
b
b
b
b
b
A
) / θ
JA
J
max, the
ns (max)
ns (max)
ns (max)
ns (max)
ns (max)
ns (max)
ns (max)
ns (max)
ns (max)
ns (max)
ns (max)
ns (max)
ns (max)
ns (max)
ns (max)
ns (max)
ns (max)
ns (max)
ns (max)
ns (max)
pF (max)
ns (max)
ns (max)
ns (max)
ns (max)
. The values
(Limits)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
Units