KP125 EVAL BOARD Infineon Technologies, KP125 EVAL BOARD Datasheet - Page 18

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KP125 EVAL BOARD

Manufacturer Part Number
KP125 EVAL BOARD
Description
BOARD EVALUATION KP125
Manufacturer
Infineon Technologies
Type
Pressure Sensorr
Datasheets

Specifications of KP125 EVAL BOARD

Contents
Fully Assembled Evaluation Board
For Use With/related Products
KP125
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
KP125EVALBOARDIN
Pressure Sensor
KP125
Package
8
Package
As well as using “green” materials, the PG-DSOF-8-12 package is optimized regarding mechanical stress
influences. The package fulfills the solder conditions for lead-free board assembly.
In the application it is recommended to ensure that the same pressure is applied to the whole package.
The KP125 is supplied with a removable plastic cap (refer to
Figure
12). The flat surface of this cap on top of the
package allows handling with standard pick-and-place tools.
After soldering the device to the printed circuit board (PCB), the cap on the PG-DSOF-8-12 may be removed.
When removing the protective cap, care should be taken to avoid damage to the device.
In some applications, such as for barometric measurements, it may be appropriate to leave the protective cap on
the package after the soldering process. Damage to the gel is prevented. The four splits in the cap side allow a
sufficient pressure coupling.
Data Sheet
18
Rev 2.14, 2007-11-23

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