l99h01 STMicroelectronics, l99h01 Datasheet
l99h01
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... L99H01XP LQFP32 April 2010 Motor bridge driver for automotive applications Description The L99H01 is designed to control 4 external N-channel MOS transistors in bridge configuration for DC-motor driving in automotive applications. A free configurable current sense amplifier is integrated. The integrated standard serial peripheral interface (SPI) controls all outputs and provides diagnostic information ...
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... Current sense amplifier (CSA 3.12 Thermal sensor interface / H-bridge switch-off input . . . . . . . . . . . . . . . . 31 3.12.1 3.12.2 3.13 Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 4 Functional description of the SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 4.1 Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 4.1.1 4.1.2 2/53 and EXT_TS-bit = low (active off EXT_TS-bit = high (thermal sensor interface Serial clock (CLK Serial data input (DI Doc ID 15567 Rev 3 L99H01 ...
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... L99H01 4.1.3 4.1.4 4.2 General data description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 4.2.1 4.2.2 4.3 Device memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 4.3.1 4.3.2 4.4 Global status byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 4.4.1 4.5 Detailed byte description of status register (StatReg0 4.6 Detailed byte description of application registers (ApplRegX 4.6.1 4.7 Read device information (ROM Packages thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 6 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 6.1 ECOPACK 6.2 PowerSSO-36 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 6.3 Packages thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 6 ...
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... Read device information (ROM Table 44. Address 0 <00(hex)> : ID-header - read only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Table 45. Address 1 <01(hex)>: product ID (LSB) - read only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Table 46. Address 2 <02(hex)>: product ID (MSB) - read only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Table 47. Address 3 <03(hex)>: SPI frame ID - read only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Table 48. PowerSSO-36 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 4/ CCP Doc ID 15567 Rev 3 L99H01 ...
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... L99H01 Table 49. LQFP32 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Table 50. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Doc ID 15567 Rev 3 List of tables 5/53 ...
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... PCB copper area in open free air condition Vs. PCB copper area in open box free air condition Doc ID 15567 Rev 3 L99H01 ( (1) ...
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... L99H01 1 Block diagram and pin description Figure 1. Block diagram V BAT V REG 5V / 3,3V Vccd DIR PWM CSN CLK µC CSO 1.1 Pinout PowerSSO-36 Table 2. Pin definitions and functions Pin Symbol 1 2 GNDD 100nF 100nF 100nF CP1+ CP1- CP2+ CP2 Central 2 Step Charge Pump ...
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... Chip select not input: this input is low active and requires CMOS logic levels. The serial data transfer between L99H01 and microcontroller is CSN enabled by pulling the input CSN to low-level. This input has a pull-up current. Serial clock input: this input controls the internal shift register of the CLK SPI and requires CMOS logic levels ...
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... L99H01 Figure 2. Pinning of device in PowerSSO-36 package GND 1 GNDD CCD DIR 6 7 PWM 8 CSN CLK CSO CSI 1+ 16 CSI 1- CSI 2+ 17 CSI The slug is connected to pin 1. 1.2 Pinout LQFP32 Table 3. Pin definitions and functions ...
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... PWM input for H-bridge control. This input has a pull-down current. Chip select not input: this input is low active and requires CMOS logic levels. The serial data transfer between L99H01 and microcontroller is CSN enabled by pulling the input CSN to low-level. This input has a pull-up current ...
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... L99H01 Figure 3. Pinning of device in LQFP-32 package 1 CP2- CP1+ 2 CP1 GND 5 GNDD 6 VCCD 7 8 VCC Block diagram and pin description PreDiag PreDiag Device LQFP32 Device LQFP32 Doc ID 15567 Rev 3 24 SL2 23 GL2 ...
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... Value -0 < 400 ms 40 -0.3 to 5.5 -0 0 Sxy - 1 to Sxy + Value ± 2 (1) ± 4 (1) L99H01 Unit Unit kV kV ...
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... L99H01 2.3 Thermal data Table 6. Operating junction temperature Item Symbol 6 Table 7. Temperature warning and thermal shutdown Item Symbol 7.1 T jTW ON 7.2 T jSD ON 7.3 T jSD OFF Table 8. Packages thermal resistance Item Symbol 8.1 R thj-amb 1. Minimum footprint. 2.4 Electrical characteristics The voltages are referred to GND and currents are assumed positive, when the current flows into the pin ...
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... -40 °C, 25 ° 1.5 1 250 500 CC d Min. Typ. increasing 2.2 2.55 decreasing 2.0 2. 0.2 0.3 POR ON Min. Typ L99H01 Max. Unit 5.1 V 0 µA 2.5 mA 150 µA 750 µA Max. Unit 2.8 V 2.6 V 0.4 V Max. Unit 100 ms ...
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... L99H01 Table 12. Inputs: CSN, CLK, PWM, DIR, EN and DI Item Symbol Parameter 12.1 V Low-level input voltage in L 12.2 V High-level input voltage in H 12.3 V Input voltage hysteresis in Hyst Pull-up current at input 12.4 I CSN in CSN Pull-down current at input 12.5 I CLK in CLK Pull-down current at input 12 Pull-down current at input 12 ...
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... Max. (2) 0.3 0.5 0 4.5 5 SHx SHx SHx (2) 0.3 0.5 0 4.5 5 SLx SLx SLx 0.8 1.4 1.9 0.6 1.2 1.8 45 170 60 210 45 170 60 210 L99H01 Unit A Ω Ω V kΩ A Ω Ω V kΩ µs µ ...
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... L99H01 Table 15. Cross current protection time Item Symbol Parameter 15.1 t Cross current protection time CCP0 15.2 t Cross current protection time CCP1 15.3 t Cross current protection time CCP2 15.4 t Cross current protection time CCP3 15.5 t Cross current protection time CCP4 15.6 t Cross current protection time CCP5 15.7 t Cross current protection time CCP6 15 ...
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... V - 250 mV OUT 200 µ OUT OUT I = -200 µA OUT Dynamic parameters Gain = 10 RL= 1 kΩ, CL Doc ID 15567 Rev 3 L99H01 Typ. Max. Unit - (2) -10 µV/°K (2) -18 µ ...
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... L99H01 Table 18. Current sense amplifier Item Symbol Parameter 18.21 SRcso_20 CSO slew rate 18.22 SRcso_50 CSO slew rate 18.23 I CSI input current CSI_10 18.24 I CSI input current CSI_20 18.25 I CSI input current CSI_50 1. Test conditions Not tested, guaranteed by design. Figure 4. Output timing diagram (active free wheeling) ...
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... Electrical specifications Figure 5. Output timing diagram (passive free wheeling) PWM PWM GH/Lx GH/Lx GLxHL GLxHL 80% 80% 50% 50% 20% 20% *: GHx for FW-low (free wheeling) GLx for FW-high 20/ GHxr GHxr Doc ID 15567 Rev 3 L99H01 t t GHxHL GHxHL t t GHxf GHxf ...
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... L99H01 2.5 SPI - electrical characteristics voltages are referred to GND and currents are assumed positive, when the current flows into the pin. Table 19. DI timing Item Symbol 19.1 t CLK 19.2 t CLKH 19.3 t CLKL 19.4 t set CSN 19.5 t set CLK 19.6 t set DI 19.7 t hold DI 19 ...
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... CC = 100 pF 100 = 100 pF 380 < 0 > 0 100 pF L Min. Typ. = 100 pF 100 pF load Transfer of 2 L99H01 Max. Unit 140 ns 100 ns 250 ns 450 ns 250 ns 450 ns 250 ns Max. Unit 140 ns 100 ns µs ...
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... L99H01 Figure 6. SPI - transfer timing diagram CSN CLK DI DO e.g.OUT1 Figure 7. SPI - input timing CSN CLK DI CSN high to low: DO enabled DI: data will be accepted on the rising edge of CLK signal actual data DO: data will change on the falling edge of CLK signal ...
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... DO pull-down load to GND C = 100 pF L 24/ tri tri H Doc ID 15567 Rev 3 L99H01 0.8 VCC 0.5 VCC 0.2 VCC 0.8 VCC 0.2 VCC 0.8 VCC 0.2 VCC 0.8 VCC 50% 0.2 VCC 50% t dis DO L tri 50% t dis DO H tri ...
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... L99H01 Figure 10. SPI - timing of status bit 0 (fault condition) CSN CLK DI DO CSN high to low and CLK stays low: status information of data bit 0 (fault condition) is transfered to DO DI: data is not accepted 0 - DO: status information of the Global Error Flag (GL_ER) stays as long as CSN is low ...
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... If the voltage V typical), the outputs are switched-off and the status registers are cleared. 3.2 Standby mode (EN) The L99H01 is activated with enable input high signal. For enable input floating (not connected inputs and outputs are switched-off. In the standby mode the current µ ...
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Table 23. Truth table Control pins Control bits N° EN DIR PWM TS/ACT_OFF FW FW_PAS CP_LOW TSD WDTO GH1 GL1 GH2 GL2 GL_ER ...
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... L99H01 Symbols: x: Don't care ● 1: Logic high or active ● 0: Logic low or not active ● H: Output in source condition ● L: Output in sink condition ● RL: Resistive low (see ● T: Tristate ● FW: Free wheeling ● FW_PAS: Free wheeling passive ● CP_LOW: Charge pump low ● ...
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... L99H01 3.4 Resistive low The resistive output mode protects the L99H01 and the H-bridge in the standby mode and in some failure modes (internal and external thermal shutdown (TSD)), charge pump low (CP_LOW), stucked reset (STK_RESET_Q) and power-on reset (PORES)). When a gate driver changes into the resistive output mode due to a failure a sequence is started. In this sequence the concerning driver is switched in sink condition for 32 µ ...
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... SCd can be programmed in 4 steps between SCd to prevent cross current in the halfbridge. The CCP can be programmed with the SPI. CCP = (0 for V CSO0 CC Doc ID 15567 Rev 3 L99H01 - 8) V). It supports internal offset IDIFF ...
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... L99H01 3.12 Thermal sensor interface / H-bridge switch-off input The TS/ACT_OFF pin is configurable by SPI with the EXT_TS bit. This pin could be used as temperature sensor interface for the H-bridge or external off for all gate drivers. The output bias current ITS_bias is on for EN = high. 3.12.1 EXT_TS-bit = low (active off) The TS/ACT_OFF input is used as a logic driver control input, without filter delay and without latching the information ...
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... Each DI communication frame consists of a <Command Byte> which is followed by 1 <Data Byte>. The data returned on DO within the same frame always starts with the <Global Status Byte>, which provides general status information about the device. This byte is followed by 1 <Data Byte> (‘In-frame-response’). 32/53 Section 2.5. Doc ID 15567 Rev 3 L99H01 ...
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... L99H01 Table 24. DI Command byte OC1 OC0 A5 Table 25 GL_ER FE STK_RESET_Q TSD WDTO 4.2.1 Command byte Each communication frame starts with a command byte. It consists of an operating code which specifies the type of operation (<Read>, <Write>, <Fault Reset>, < ...
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... Functional description of the SPI <Read Device Information> allows access to the ROM area which contains device related information such as <ID-Header>, <Product Code>, <Silicon Version and Category> and <SPI-frame-ID>. More detailed descriptions of the device information are available in 34/53 Doc ID 15567 Rev 3 L99H01 Section 4.7 . ...
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Device memory map 4.3.1 Control and status (RAM) address map Table 28. Control and status (RAM) address map Name Access Address Stat Reg0 Read/ Clear Appl Reg1 Read/ ...
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... The flag is reflected via the DO pin while CSN is held low and no clock signal is available. The flag remains as long as CSN is low. This operation does not cause the <communication error> bit in the <Global Status Byte> set. 36/ STK_RESET_Q Section 3.4: Resistive Doc ID 15567 Rev 3 L99H01 TSD WDTO Section 3 ...
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... L99H01 4.4.1 SPI clock monitor and watchdog Figure 11. Global error flag diagram SDI SCK CSN SDO / Err 1. Writing a “1” to RWD - bit in ApplRegx restarts the internal watchdog counter. The clock monitor counts the number of clock pulses during a communication frame (while CSN is low). If the number of SCK pulses does not correspond with the frame width indicated in the < ...
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... The CP_LOW bit has to be cleared through a software reset to reactivate the gate driver. 38/ DS_MON_2 DS_MON_1 0 0 Register DS_MON_3 DS_MON_2 DS_MON_1 DS_MON_0 Chapter 3.12.1. Chapter Doc ID 15567 Rev 3 Table 31 shows the DS_MON_0 X X OT_EXT CP_LOW Deactivated driver High-side 2 High-side 1 Low-side 2 Low-side 1 3.12.2. L99H01 0 0 ...
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... L99H01 4.6 Detailed byte description of application registers (ApplRegX) The write/read operation starts always with a command byte followed by 1 data byte. 4.6.1 Description of the data byte The device uses 3 application registers to configure the device. Note that the last row shows the logic levels during a reset phase. ...
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... CSA2 (CSI2+ / CSI2-) CSA1 (CSI1+ / CSI1-) GCSA_0 Doc ID 15567 Rev MCSA GCSA_1 GCSA_0 Protection time 250 ns 500 ns 750 ns 1000 ns 1250 ns 1500 ns 1750 ns 2000 ns Selected amplifier Gain Not applicable L99H01 0 0 ...
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... L99H01 Table 40. Address 3 <03(hex)> : ApplReg3 – read/write Bit 7 Name RWD EXT_TS EXTTH_5 EXTTH_4 EXTTH_3 EXTTH_2 EXTTH_1 EXTTH_0 <default> 0 Comments: RWD: Restarts the watchdog counter ● EXT_TS: The bit select the mode of the input pin TS/ACT_OFF: ● – EXT_TS = low (active off): TS/ACT_OFF pin is used as input to switch the H-bridge in tristate and back ...
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... Reserved, accessing this address is recognized as a failure, the 3FH device enters a fail-safe state (see FAM_0 NR_PI_5 NR_PI_4 Doc ID 15567 Rev 3 Device information <ID-Header> <Product Code 1> <Product Code 2> <SPI-frame-ID> Table 30: STK_RESET_Q). ( NR_PI_3 NR_PI_2 NR_PI_1 ( L99H01 0 NR_PI_0 ...
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... L99H01 Table 46. Address 2 <02(hex)>: product ID (MSB) - read only Bit 7 Name PR_ID_15 PR_ID_14 PR_ID_13 PR_ID_12 PR_ID_11 PR_ID_10 PR_ID_9 PR_ID_8 <default> Addressable only through a read device Information command. The <SPI-frame-ID> (ROM address 03H) provides information about the register width ( bytes) and the availability of ‘burst mode read’ option. ...
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... FR4 area = 129 mm, PCB thickness =1.6 mm, Cu thickness =70 µm (front and back side), Copper areas: from minimum pad layout 44/53 vs. PCB copper area in open free air condition thj-amb 2 4 PCB Cu heatsink area (cm^2) and Z measurements (PCB: double layer, thermal vias Doc ID 15567 Rev 3 L99H01 6 8 (1) 10 ...
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... L99H01 6 Package and packing information ® 6.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. 6.2 PowerSSO-36 package information Figure 13 ...
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... “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side (0.006”). 46/53 Millimeters Min. Typ. 2. 0.18 - 0.23 - 10. 0.5 - 8 0° 1.2 - 0.8 - 2 4.1 - 6.5 - Doc ID 15567 Rev 3 L99H01 Max. 2.45 2.35 0.1 0.36 0.32 10.50 7 0.1 10.5 0.4 8° 10° 4.7 7.1 ...
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... L99H01 6.3 Packages thermal data Figure 14. LQFP32 R RTHj_amb(°C/ Layout condition of Rth and Zth measurements (PCB: double layer, thermal vias, FR4 area = mm, PCB thickness =1.6 mm, Cu thickness =70 µm (front and back side), copper areas: from minimum pad layout ...
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... Package and packing information 6.4 LQFP32 package information Figure 15. LQFP32 package dimensions 48/53 Doc ID 15567 Rev 3 L99H01 ...
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... L99H01 Table 49. LQFP32 mechanical data Dim ( ccc 1. LQFP stands for low profile quad flat pachage. Low profile: Body thickness (A2 = 1.40 mm) Package and packing information Millimeter Min. Typ. 0.05 1.35 1.40 0.30 0.37 0.09 8.80 9.00 6.80 7.00 5.60 8.80 9.00 6.80 7.00 5.60 0.80 0.45 0.60 1.00 0° 3.5° Doc ID 15567 Rev 3 Max. ...
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... All dimensions are in mm (±0. (±0.05) 1.55 D1 (min) 1.5 F (±0.1) 11.5 K (max) 2.85 P1 (±0.1) End 2 Top No components Components cover 500mm min tape Doc ID 15567 Rev 3 L99H01 49 1225 532 3.5 13.8 0.6 Reel dimensions Base qty 1000 Bulk qty 1000 A (max) 330 B (min) 1.5 C (±0. 20.2 G (+2 / -0) 24.4 N (min) 100 T (max) 30 ...
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... L99H01 6.6 LQFP32 packing information Figure 18. LQFP32 tape and reel shipment (suffix “TR”) Figure 19. LQFP32 tray shipment (no suffix) Package and packing information Doc ID 15567 Rev 3 51/53 ...
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... Updated the CP value in Doc ID 15567 Rev 3 Changes Table 18: Current sense amplifier. : added min/typ/max value updated whole IOFF-T50 ), updated whole IOFF-T20 ), updated whole IOFF-T10 : added min/typ/max value IOFF added min/typ/max value 10 table. Section 3.11, Section 3.12.1 and and Section 4.6.1. Table 4: Absolute maximum ratings L99H01 Section 3.12.2. ...
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... L99H01 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...