PESD5V0U1UB,115 NXP Semiconductors, PESD5V0U1UB,115 Datasheet - Page 9

• Manufacturer Part Number: PESD5V0U1UB,115
• Description: DIODE ESD PROT UNI 5V SC-79
• Manufacturer: NXP Semiconductors
• Type: TVSr

Specifications of PESD5V0U1UB,115

• Package / Case: SC-79, SOD-523
• Voltage - Reverse Standoff (typ): 5V
• Voltage - Breakdown: 6.8V
• Polarization: Unidirectional
• Mounting Type: Surface Mount
• Polarity: Unidirectional
• Channels: 1 Channel
• Operating Voltage: 5 V
• Breakdown Voltage: 6.8 V
• Termination Style: SMD/SMT
• Capacitance: 1.7 pF
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 55 C
• Dimensions: 1.35 mm W x 2.7 mm L x 1.1 mm H
• Capacitance Value: 2.6 pF
• Direction Type: Uni-Directional
• Number Of Elements Per Chip: 1
• Esd Protection Voltage: 10@HBM|9@Contact Disc KV
• Maximum Leakage Current: 0.1 uA
• Maximum Working Voltage: 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4671-2; 934062186115; PESD5V0U1UB T/R

NXP Semiconductors
PESD5V0U1UA_UB_UL_1
Product data sheet
Fig 11. Reflow soldering footprint PESD5V0U1UB (SOD523/SC-79)
Fig 12. Reflow soldering footprint PESD5V0U1UL (SOD882)
0.9
1.2
Reflow soldering is the only recommended soldering method.
Reflow soldering is the only recommended soldering method.
(2 )
(2 )
0.3
0.4
(2 )
(2 )
0.7
0.8
Rev. 01 — 30 October 2008
1.3
0.7
Ultra low capacitance unidirectional ESD protection diodes
2.15
1.1
(2 )
0.6
PESD5V0U1UA/UB/UL
R0.05 (8 )
(2 )
0.7
(2 )
0.5
(2 )
0.6
Dimensions in mm
Dimensions in mm
solder lands
solder resist
solder paste
occupied area
© NXP B.V. 2008. All rights reserved.
solder lands
solder resist
solder paste
occupied area
sod523_fr
sod882_fr
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