PESD24VS2UT,215 NXP Semiconductors, PESD24VS2UT,215 Datasheet - Page 10

• Manufacturer Part Number: PESD24VS2UT,215
• Description: DIODE ESD PROTECTION SOT23
• Manufacturer: NXP Semiconductors

Specifications of PESD24VS2UT,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Reverse Standoff (typ): 24V
• Voltage - Breakdown: 26.5V
• Power (watts): 160W
• Polarization: 2 Channel Array - Unidirectional
• Mounting Type: Surface Mount
• Polarity: Unidirectional
• Clamping Voltage: 36 V
• Operating Voltage: 24 V
• Breakdown Voltage: 27 V
• Termination Style: SMD/SMT
• Peak Surge Current: 3 A
• Peak Pulse Power Dissipation: 160 W
• Capacitance: 32 pF
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Dimensions: 1.4 mm W x 3 mm L x 1.1 mm H
• Number Of Elements: 2
• Operating Temperature Classification: Military
• Reverse Breakdown Voltage: 26.5V
• Reverse Stand-off Voltage: 24V
• Leakage Current (max): 1uA
• Peak Pulse Current: 3A
• Test Current (it): 5mA
• Operating Temp Range: -65C to 150C
• Mounting: Surface Mount
• Pin Count: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4038-2; 934057612215; PESD24VS2UT T/R; PESD24VS2UT T/R

NXP Semiconductors
APPLICATION INFORMATION
The PESDxS2UT series is designed for uni-directional protection for up to two lines against damage caused by
ElectroStatic Discharge (ESD) and surge pulses. The PESDxS2UT series may be used on lines where the signal
polarities are below ground. PESDxS2UT series provide a surge capability of up to 330 W (P
waveform.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The
following guidelines are recommended:
• Place the PESDxS2UT as close as possible to the input terminal or connector.
• The path length between the PESDxS2UT and the protected line should be minimized.
• Keep parallel signal paths to a minimum.
• Avoid running protected conductors in parallel with unprotected conductors.
• Minimize all printed-circuit board conductive loops including power and ground loops.
• Minimize the length of transient return paths to ground.
• Avoid using shared return paths to a common ground point.
• Ground planes should be used whenever possible. For multilayer printed-circuit boards use ground vias.
2004 Apr 15
Double ESD protection diodes in SOT23
package
Fig.10 Typical application: ESD protection of data lines.
unidirectional protection
of two lines
line 1 to be protected
line 2 to be protected
PESDxS2UT
ground
10
bidirectional protection
of one line
PESDxS2UT
line 1 to be protected
ground
001aaa491
PESDxS2UT series
pp
) per line for an 8/20 µs
Product data sheet