PIC16F737-I/SP Microchip Technology, PIC16F737-I/SP Datasheet - Page 251

• Manufacturer Part Number: PIC16F737-I/SP
• Description: IC PIC MCU FLASH 4KX14 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F737-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 7KB (4K x 14)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 25
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 368 B
• Interface Type: AUSART/CCP/I2C/MSSP/SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 3
• Operating Supply Voltage: 4 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 11-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: I3DBF777 - BOARD DAUGHTER ICEPIC3
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

SPI is a trademark of Motorola Corporation.
I
M
2
C is a trademark of Philips Corporation.
1997 Microchip Technology Inc.
Section 16. Basic Sychronous Serial Port (BSSP)
HIGHLIGHTS
This section of the manual contains the following major topics:
16.1 Introduction ..................................................................................................................16-2
16.2 Control Registers .........................................................................................................16-3
16.3 SPI™ Mode..................................................................................................................16-6
16.4 SSP I
16.5 Initialization ................................................................................................................16-23
16.6 Design Tips ................................................................................................................16-24
16.7 Related Application Notes..........................................................................................16-25
16.8 Revision History .........................................................................................................16-26
Note:
Please refer to
use this module.
2
C Operation .....................................................................................................16-15
Appendix C.2
or the device data sheet to determine which devices
DS31016A page 16-1
16