PIC16F737-I/SP Microchip Technology, PIC16F737-I/SP Datasheet - Page 38

IC PIC MCU FLASH 4KX14 28DIP

PIC16F737-I/SP

Manufacturer Part Number
PIC16F737-I/SP
Description
IC PIC MCU FLASH 4KX14 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F737-I/SP

Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
25
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
AUSART/CCP/I2C/MSSP/SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
25
Number Of Timers
3
Operating Supply Voltage
4 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3DBF777 - BOARD DAUGHTER ICEPIC3
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PICmicro MID-RANGE MCU FAMILY
2.3.3
DS31002A-page 2-8
Tuning the Oscillator Circuit
Since Microchip devices have wide operating ranges (frequency, voltage, and temperature;
depending on the part and version ordered) and external components (crystals, capacitors,...),
of varying quality and manufacture; validation of operation needs to be performed to ensure that
the component selection will comply with the requirements of the application.
There are many factors that go into the selection and arrangement of these external components.
These factors include:
• amplifier gain
• desired frequency
• resonant frequency(s) of the crystal
• temperature of operation
• supply voltage range
• start-up time
• stability
• crystal life
• power consumption
• simplification of the circuit
• use of standard components
• combination which results in fewest components
1997 Microchip Technology Inc.

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