PIC16F777-I/P Microchip Technology, PIC16F777-I/P Datasheet - Page 109
![IC PIC MCU FLASH 8KX14 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16F777-I/P
Manufacturer Part Number
PIC16F777-I/P
Description
IC PIC MCU FLASH 8KX14 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F737-ISP.pdf
(276 pages)
4.PIC16F737-ISP.pdf
(10 pages)
Specifications of PIC16F777-I/P
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
36
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
AUSART/CCP/I2C/MSSP/SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
36
Number Of Timers
3
Operating Supply Voltage
4 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3DBF777 - BOARD DAUGHTER ICEPIC3DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD444-1001 - DEMO BOARD FOR PICMICRO MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F777-I/P
Manufacturer:
MIC
Quantity:
5 510
Company:
Part Number:
PIC16F777-I/P
Manufacturer:
ATMEL
Quantity:
5 510
Company:
Part Number:
PIC16F777-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F737-ISP PDF datasheet #3
- PIC16F737-ISP PDF datasheet #4
- Current page: 109 of 688
- Download datasheet (3Mb)
1997 Microchip Technology Inc.
Example 6-4: RAM Initialization
Bank0_LP
;
; Next Bank (Bank1)
; (** ONLY REQUIRED IF DEVICE HAS A BANK1 **)
;
Bank1_LP
;
; Next Bank (Bank2)
; (** ONLY REQUIRED IF DEVICE HAS A BANK2 **)
;
Bank2_LP
;
; Next Bank (Bank3)
; (** ONLY REQUIRED IF DEVICE HAS A BANK3 **)
;
Bank3_LP
:
CLRF
MOVLW
MOVWF
CLRF
INCF
BTFSS
GOTO
MOVLW
MOVWF
CLRF
INCF
BTFSS
GOTO
BSF
MOVLW
MOVWF
CLRF
INCF
BTFSS
GOTO
MOVLW
MOVWF
CLRF
INCF
BTFSS
GOTO
Section 6. Memory Organization
STATUS
0x20
FSR
INDF0
FSR
FSR, 7
Bank0_LP
0xA0
FSR
INDF0
FSR
STATUS, C
Bank1_LP
STATUS, IRP
0x20
FSR
INDF0
FSR
FSR, 7
Bank2_LP
0xA0
FSR
INDF0
FSR
STATUS, C
Bank3_LP
; Clear STATUS register (Bank0)
; 1st address (in bank) of GPR area
; Move it to Indirect address register
; Clear GPR at address pointed to by FSR
; Next GPR (RAM) address
; End of current bank ? (FSR = 80h, C = 0)
; NO, clear next location
; 1st address (in bank) of GPR area
; Move it to Indirect address register
; Clear GPR at address pointed to by FSR
; Next GPR (RAM) address
; End of current bank? (FSR = 00h, C = 1)
; NO, clear next location
; Select Bank2 and Bank3
;
; 1st address (in bank) of GPR area
; Move it to Indirect address register
; Clear GPR at address pointed to by FSR
; Next GPR (RAM) address
; End of current bank? (FSR = 80h, C = 0)
; NO, clear next location
; 1st address (in bank) of GPR area
; Move it to Indirect address register
; Clear GPR at address pointed to by FSR
; Next GPR (RAM) address
; End of current bank? (FSR = 00h, C = 1)
; NO, clear next location
; YES, All GPRs (RAM) is cleared
for Indirect addressing
DS31006A-page 6-15
6
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