PIC16F777-I/P Microchip Technology, PIC16F777-I/P Datasheet - Page 593
PIC16F777-I/P
Manufacturer Part Number
PIC16F777-I/P
Description
IC PIC MCU FLASH 8KX14 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F737-ISP.pdf
(276 pages)
4.PIC16F737-ISP.pdf
(10 pages)
Specifications of PIC16F777-I/P
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
36
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
AUSART/CCP/I2C/MSSP/SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
36
Number Of Timers
3
Operating Supply Voltage
4 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3DBF777 - BOARD DAUGHTER ICEPIC3DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD444-1001 - DEMO BOARD FOR PICMICRO MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F777-I/P
Manufacturer:
MIC
Quantity:
5 510
Company:
Part Number:
PIC16F777-I/P
Manufacturer:
ATMEL
Quantity:
5 510
Company:
Part Number:
PIC16F777-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F737-ISP PDF datasheet #3
- PIC16F737-ISP PDF datasheet #4
- Current page: 593 of 688
- Download datasheet (3Mb)
30.19
Note 1: Specification 73A is only required if specifications 71A and 72A are used.
Param.
1997 Microchip Technology Inc.
No.
71A
72A
73A
70
71
72
73
74
75
76
78
79
80
SCK
(CKP = 0)
(CKP = 1)
SDO
SDI
SS
SCK
† Data in “Typ” column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
Refer to
tested.
TssL2scH,
TssL2scL
TscH
TscL
TdiV2scH,
TdiV2scL
T
TscH2diL,
TscL2diL
TdoR
TdoF
TscR
TscF
TscH2doV,
TscL2doV
B
Symbol
Example SSP and Master SSP SPI Mode Timing Waveforms and Requirements
2
B
Figure 30-1
Figure 30-9:
Table 30-21:
Characteristic
SS to SCK or SCK input
SCK input high time
(slave mode)
SCK input low time
(slave mode)
Setup time of SDI data input to SCK edge
Last clock edge of Byte1 to the 1st clock
edge of Byte2
Hold time of SDI data input to SCK edge
SDO data output rise time PIC16CXXX
SDO data output fall time
SCK output rise time
(master mode)
SCK output fall time (master mode)
SDO data output valid
after SCK edge
Section 30. Electrical Specifications
70
for load conditions.
80
71
73
MSb IN
Example SPI Mode Requirements (Master Mode, CKE = 0)
MSb
Example SPI Master Mode Timing (CKE = 0)
74
72
75, 76
Continuous
Single Byte
Continuous
Single Byte
PIC16LCXXX
PIC16CXXX
PIC16LCXXX
PIC16CXXX
PIC16LCXXX
BIT6 - - - - - -1
BIT6 - - - -1
1.25T
1.25T
1.5T
78
79
Min
T
100
100
CY
40
40
—
—
—
—
—
—
—
—
CY
CY
CY
+ 40
+ 30
+ 30
LSb
79
78
LSb IN
Typ† Max Units
—
—
—
—
—
—
—
—
10
20
10
10
20
10
—
—
100
—
—
—
—
—
—
—
—
25
45
25
25
45
25
50
DS31030A-page 30-23
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Note 1
Note 1
Note 1
Conditions
30
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