PIC16F777-I/P Microchip Technology, PIC16F777-I/P Datasheet - Page 633
![IC PIC MCU FLASH 8KX14 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16F777-I/P
Manufacturer Part Number
PIC16F777-I/P
Description
IC PIC MCU FLASH 8KX14 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F737-ISP.pdf
(276 pages)
4.PIC16F737-ISP.pdf
(10 pages)
Specifications of PIC16F777-I/P
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
36
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
AUSART/CCP/I2C/MSSP/SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
36
Number Of Timers
3
Operating Supply Voltage
4 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3DBF777 - BOARD DAUGHTER ICEPIC3DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD444-1001 - DEMO BOARD FOR PICMICRO MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F777-I/P
Manufacturer:
MIC
Quantity:
5 510
Company:
Part Number:
PIC16F777-I/P
Manufacturer:
ATMEL
Quantity:
5 510
Company:
Part Number:
PIC16F777-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F737-ISP PDF datasheet #3
- PIC16F737-ISP PDF datasheet #4
- Current page: 633 of 688
- Download datasheet (3Mb)
31.3.6
31.3.7
1997 Microchip Technology Inc.
Tested Crystals and Their Capacitor Values
Example EPROM Memory Erase Times
This table shows the crystal frequency and manufacturer that was used for every tests in this sec-
tion, as well as the capacitor values/ranges that exhibited the best characteristics.
Table 31-2: Example Capacitor Selection for Crystal Oscillators
The UV erase time of an EPROM cell depends on the geometry size of the EPROM cell and the
manufacturing technology.
device.
Table 31-3: Example of Typical EPROM Erase Time Recommendations
Table 31-4:
Note 1: If these criteria are not met, the erase times will be different.
Note:
Example
Device
Crystals Used:
Section 31. Device Characteristics
1
2
3
4
Osc Type
200 kHz
20 MHz
32 kHz
1 MHz
4 MHz
8 MHz
HS
LP
XT
Higher capacitance increases the stability of the oscillator but also increases the start-up time.
These values are for design guidance only.
mode to avoid overdriving crystals with low drive level specification. Since each crystal has its
own characteristics, the user should consult the crystal manufacturer for appropriate values of
external components or verify oscillator performance.
Refer to the device data sheet for the typical erase times for a device.
(Angstroms)
Wavelength
2537
2537
2537
2537
Crystal Frequency
Table 31-3
200 kHz
200 kHz
20 MHz
EPSON CA-301 20.000M-C
32 kHz
1 MHz
4 MHz
4 MHz
8 MHz
EPSON CA-301 8.000M-C
Epson C-001R32.768K-A
STD XTL 200.000KHz
shows some of the expected erase times for each different
ECS ECS-10-13-1
ECS ECS-40-20-1
( W/cm
Intensity
12,000
12,000
12,000
12,000
Capacitor Range
2
)
Rs
may be required in HS mode as well as XT
47-68 pF
15-33 pF
15-33 pF
Distance from UV
C1
lamp (inches)
33 pF
15 pF
15 pF
15 pF
15 pF
1
1
1
1
Capacitor Range
DS31031A-page 31-21
Typical Time
20 PPM
20 PPM
50 PPM
50 PPM
30 PPM
30 PPM
47-68 pF
15-33 pF
15-33 pF
(minutes)
C2
15 - 20
33 pF
15 pF
15 pF
15 pF
15 pF
20
40
60
(1)
31
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