PIC16F777-I/P Microchip Technology, PIC16F777-I/P Datasheet - Page 331
![IC PIC MCU FLASH 8KX14 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16F777-I/P
Manufacturer Part Number
PIC16F777-I/P
Description
IC PIC MCU FLASH 8KX14 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F737-ISP.pdf
(276 pages)
4.PIC16F737-ISP.pdf
(10 pages)
Specifications of PIC16F777-I/P
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
36
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
AUSART/CCP/I2C/MSSP/SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
36
Number Of Timers
3
Operating Supply Voltage
4 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3DBF777 - BOARD DAUGHTER ICEPIC3DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD444-1001 - DEMO BOARD FOR PICMICRO MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F777-I/P
Manufacturer:
MIC
Quantity:
5 510
Company:
Part Number:
PIC16F777-I/P
Manufacturer:
ATMEL
Quantity:
5 510
Company:
Part Number:
PIC16F777-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F737-ISP PDF datasheet #3
- PIC16F737-ISP PDF datasheet #4
- Current page: 331 of 688
- Download datasheet (3Mb)
17.4.18.3 Bus Collision During a STOP Condition
1997 Microchip Technology Inc.
SDA
SCL
PEN
BCLIF
P
SSPIF
SSPIF
BCLIF
SDA
PEN
SCL
P
Bus collision occurs during a STOP condition if:
a)
b)
The STOP condition begins with SDA asserted low. When SDA is sampled low, the SCL pin is
allow to float. When the pin is sampled high (clock arbitration), the baud rate generator is loaded
with SSPADD<6:0> and counts down to 0. After the BRG times out SDA is sampled. If SDA is
sampled low, a bus collision has occurred. This is due to another master attempting to drive a
data '0'
collision occurs. This is another case of another master attempting to drive a data '0'
(Figure
Figure 17-40: Bus Collision During a STOP Condition (Case 1)
Figure 17-41: Bus Collision During a STOP Condition (Case 2)
After the SDA pin has been de-asserted and allowed to float high, SDA is sampled low
after the BRG has timed out.
After the SCL pin is de-asserted, SCL is sampled low before SDA goes high.
(Figure
17-41).
Assert SDA
T
SDA asserted low
BRG
17-40). If the SCL pin is sampled low before SDA is allowed to float high, a bus
T
BRG
Preliminary
T
BRG
T
BRG
Section 17. MSSP
SCL goes low before SDA goes high
Set BCLIF
T
BRG
T
BRG
DS31017A-page 17-55
'0'
'0'
SDA sampled
low after T
Set BCLIF
'0'
'0'
BRG
,
17
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